Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學(xué)報(bào)

ZHONGGUO YOUSEJINSHU XUEBAO

第32卷    第11期    總第284期    2022年11月

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文章編號(hào):1004-0609(2022)-11-3294-12
高硅鋁合金Al-20Si-xCu熱裂行為及其機(jī)理
袁建偉,陳翌慶,余俊超,張凱旋,周銳

(合肥工業(yè)大學(xué) 材料科學(xué)與工程學(xué)院,合肥 230009)

摘 要: 本文研究了Al-20Si-xCu系列合金的凝固過程和熱裂行為。采用差熱分析法(DTA)對(duì)凝固過程進(jìn)行了分析,用自制的T形模具對(duì)其熱裂行為進(jìn)行了研究,并用Clyne和Davis模型對(duì)三元合金熱裂敏感性進(jìn)行了預(yù)測(cè)。結(jié)果表明:用裂紋敏感性系數(shù)(CSC)預(yù)測(cè)的合金熱裂敏感性趨勢(shì)與Al-20Si-xCu系列合金的實(shí)驗(yàn)結(jié)果一致,合金的熱裂敏感性(Hot tearing sensitivity,HTS)大小順序?yàn)锳l-20Si-3Cu>Al-20Si-4Cu>Al-20Si-2Cu>Al-20Si-1Cu。同時(shí),運(yùn)用ProCAST模擬軟件采用基于有限元(FEM)的數(shù)值計(jì)算和綜合求解的方法,對(duì)合金鑄件充型、凝固和冷卻過程進(jìn)行模擬,預(yù)測(cè)合金澆注過程產(chǎn)生的熱裂應(yīng)力以及熱裂指標(biāo)(HTI)等參數(shù),其數(shù)值模擬結(jié)果與實(shí)驗(yàn)結(jié)果吻合較好。

 

關(guān)鍵字: 鋁硅合金;熱裂敏感性;熱分析;數(shù)值模擬

Hot tearing behavior and its mechanism of high silicon aluminum alloy Al-20Si-xCu
YUAN Jian-wei, CHEN Yi-qing, YU Jun-chao, ZHANG Kai-xuan, ZHOU Rui

School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China

Abstract:The solidification process and hot tearing behavior of Al-20Si-xCu series alloys were investigated. The solidification process was analyzed by differential thermal analysis (DTA) and the hot tearing behavior was studied by self-made “T” mold, the Clyne and Davis models were used to predict the hot tearing sensitivity of ternary alloy. The results show that the hot tearing sensitivity predicted by the crack sensitivity coefficient (CSC) is consistent with the experimental results of Al-20Si-xCu series alloys. The hot tearing sensitivity (HTS) of the alloys is Al-20Si-3Cu>Al-20Si-4Cu>Al-20Si-2Cu>Al-20Si-1Cu. At the same time, ProCAST simulation software was used to simulate the filling, solidification and cooling processes of alloy castings by using the method of numerical calculation and comprehensive solution based on finite element method (FEM), and the hot tearing stress and hot tearing index (HTI) were predicted. The numerical simulation results were in good agreement with the experimental results.

 

Key words: aluminum-silicon alloy; hot crack sensitivity; thermal analysis; the numerical simulation

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學(xué)技術(shù)協(xié)會(huì) 主辦:中國有色金屬學(xué)會(huì) 承辦:中南大學(xué)
湘ICP備09001153號(hào) 版權(quán)所有:《中國有色金屬學(xué)報(bào)》編輯部
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