(1. 中南大學(xué)材料科學(xué)與工程學(xué)院，長(zhǎng)沙410083；
2. 銅陵有色金屬集團(tuán)股份有限公司金威銅業(yè)有限公司，銅陵244000；
3. 中國(guó)鋁業(yè)集團(tuán)有限公司中鋁洛陽(yáng)銅加工有限公司，洛陽(yáng)471000；
4. 有研科技集團(tuán)有限公司有色金屬材料制備加工國(guó)家重點(diǎn)實(shí)驗(yàn)室，北京100088；
5. 有研工程技術(shù)研究院有限公司，北京101407)
摘 要: 本文研究了晶界工程處理對(duì)超微合金化無(wú)氧銅的組織結(jié)構(gòu)與耐熱性的影響。通過(guò)熔煉鑄造制備了超微合金化無(wú)氧銅，并對(duì)其施以晶界工程處理，測(cè)試了晶界工程處理前后超微合金化無(wú)氧銅的耐熱性，表征了晶界工程處理前后超微合金化無(wú)氧銅的組織結(jié)構(gòu)。結(jié)果表明：晶界工程處理(每道次的處理工藝為:冷軋20%+(300 ℃, 60 min)退火)可以顯著提高超微合金化無(wú)氧銅的耐熱性，經(jīng)4道次晶界工程處理的超微合金化無(wú)氧銅在(900℃, 60min)退火后晶粒長(zhǎng)大不明顯，含孿晶的平均晶粒尺寸從23.5 μm增長(zhǎng)到29.2 μm，不含孿晶的平均晶粒尺寸從60.4 μm增長(zhǎng)到71.9 μm。晶界工程處理也可以有效調(diào)控超微合金化無(wú)氧銅的組織結(jié)構(gòu)，主要體現(xiàn)為Σ3n重位點(diǎn)陣晶界比例增加和普通晶界網(wǎng)格連通性顯著降低。
關(guān)鍵字: 晶界工程；無(wú)氧銅；組織結(jié)構(gòu)；耐熱性
（1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. Jinvi Copper Co., Ltd., Tongling Nonferrous Metals Group Co., Ltd.,Tongling 244000, China;
3. CHINALCO Luoyang Copper Processing Co., Ltd.,Aluminum Corporation of China Group Co., Ltd., Luoyang 471000, China;
4. State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 100088, China;
5. GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China）
Abstract:In this work, the effect of grain boundary engineering (GBE) treatment on microstructure and thermal stability of an ultra-microalloyed oxygen-free copper was studied. The oxygen-free copper was prepared by melting and casting, and then was subjected to GBE treatment. The thermal stabilitiesof the oxygen-free copper before and after GBE treatment were tested, and their microstructures were also characterized. The results show that the GBE treatment (each pass of it consists of cold rolling with a reduction of 20% followed by annealing at 300 ℃ for 60 min) significantly improves the thermal stability of the oxygen-free copper. After annealing at 900 ℃for 60 min, the grain growth of the oxygen-free copper after 4 passes GBE treatment is a little. The average grain size (including twins) increases from 23.5 μm to 29.2 μm, and the average grain size (excluding twins) increases from 60.4 μm to 71.9 μm. The GBE treatment also hasan influence on the microstructure of the oxygen-free copper, especially increasing the Σ3n coincidence site lattice boundary fraction and decreasing the normal grain boundary network connectivity.
Key words: grain boundary engineering; oxygen-free copper; microstructure; thermal stability
