Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學報

ZHONGGUO YOUSEJINSHU XUEBAO

第31卷    第5期    總第266期    2021年5月

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文章編號:1004-0609(2021)-05-1270-15
電解銅箔表面處理技術及添加劑研究進展
師慧娟1,陸冰滬2,樊小偉1,李大雙2,鄭小偉2,劉 耀1,譚育慧1,唐云志1

(1. 江西理工大學 材料冶金化學學部,贛州 341000;
2. 安徽銅冠銅箔有限公司,池州 247100
)

摘 要: 隨著5G通訊、新能源汽車等高端產(chǎn)業(yè)的發(fā)展,對電解銅箔產(chǎn)品性能提出更高的要求。表面處理技術是銅箔生產(chǎn)中極為重要的一項工藝技術,是解決銅箔綠色環(huán)保生產(chǎn)和獲得高性能電解銅箔的主要途徑。本文從國內(nèi)外銅箔研究現(xiàn)狀出發(fā),歸納了包含粗化、固化、合金化、鈍化、硅烷化等工藝流程的表面處理技術,并對每道工序中電解液的成分以及電沉積的影響因素進行分類總結,綜述了粗化工序中添加劑的分類及研究現(xiàn)狀與技術進展,重點闡述了包括晶粒細化劑、整平劑、光亮劑、表面活性劑與無機鹽等各添加劑的作用機理及其對銅箔組織形貌和性能變化的影響規(guī)律,展望了我國銅箔的發(fā)展方向,為我國自主開發(fā)高性能銅箔生產(chǎn)技術提供參考。

 

關鍵字: 電解銅箔;表面處理;添加劑;作用機理;組織;性能

Research progress of electrolytic copper foil surface treatment technology and additives
SHI Hui-juan1, LU Bing-hu2, FAN Xiao-wei1, LI Da-shuang2, ZHENG Xiao-wei2, LIU Yao1, TAN Yu-hui1, TANG Yun-zhi1

1.Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China;
2.Anhui Tongguan Copper Foil Co., Ltd., Chizhou 247100, China

Abstract:With the development of high-end industries, such as 5G communications and new-energy vehicles, the higher requirements for the capabilities of electrolytic copper foil products were put forward. Using an extremely important technology, the electrolyticcopper foil surface treatment is regarded as a primary way for solving copper foil green production problem and obtaining high performance coating copper foil. Here, the present domestic and foreign research status of copper foil surface treatment including coarsing process, curing process, alloying process, passivation process, silanization process, etc, were documented and summarized. Especially, the composition of the electrolyte in each process and the influencing factors of electrodeposition were presented and analyzed, respectively. Moreover, we reviewed the research status and classification of additives in coarsening progress, and emphasized the mechanism of each additives including grain refiner, leveling agent, brightener, surfactant and inorganic additive, as well as the effects of additives on morphology and properties of copper foil. Finally, the future development direction of copper foil in China was pointed out. We believe that this review will provide a reference for our country independent development of high-performance copper foil production technology.

 

Key words: electrolytic copper foil; surface treatment; additive; function mechanism; structure; performance

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學技術協(xié)會 主辦:中國有色金屬學會 承辦:中南大學
湘ICP備09001153號 版權所有:《中國有色金屬學報》編輯部
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