(1. 大連理工大學(xué) 材料科學(xué)與工程學(xué)院，大連 116024；
2. 大連理工大學(xué) 遼寧省先進(jìn)連接技術(shù)重點(diǎn)實(shí)驗(yàn)室，大連 116024)
摘 要: 研究Cu/Sn/Ni焊點(diǎn)在250 ℃液-固界面反應(yīng)過(guò)程中Cu-Ni交互作用對(duì)界面反應(yīng)的影響。結(jié)果表明：液-固界面反應(yīng)10 min后，Cu-Ni交互作用就已經(jīng)發(fā)生，Sn/Cu及Sn/Ni界面金屬間化合物(IMCs)由浸焊后的Cu6Sn5和Ni3Sn4均轉(zhuǎn)變?yōu)?Cu,Ni)6Sn5，界面IMCs形貌也由扇貝狀轉(zhuǎn)變?yōu)槎贪魻睢Ｔ陔S后的液-固界面反應(yīng)過(guò)程中，兩界面IMCs均保持為(Cu,Ni)6Sn5類型，但隨著反應(yīng)的進(jìn)行，界面IMC的形貌變得更加凸凹不平。Sn/Cu和Sn/Ni界面IMCs厚度均隨液-固界面反應(yīng)時(shí)間的延長(zhǎng)不斷增加，界面IMCs生長(zhǎng)指數(shù)分別為0.32和0.61。在液-固界面反應(yīng)初始階段，Sn/Cu界面IMC的厚度大于Sn/Ni界面IMC的厚度；液-固界面反應(yīng)2 h后，由于Cu-Ni交互作用，Sn/Cu界面IMC的厚度要小于Sn/Ni界面IMC的厚度，并在液-固界面反應(yīng)6 h后分別達(dá)到15.78和23.44 μm。
關(guān)鍵字: Cu-Ni交互作用；液-固界面反應(yīng)；Cu/Sn/Ni焊點(diǎn)；金屬間化合物
（1. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory of Liaoning Advanced Welding and Joining Technology, Dalian University of ）
Abstract:The effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn/Ni solder joint at 250 ℃ was investigated. The results show that the Cu-Ni cross-solder interaction occurs after liquid-solid reaction for 10 min, the initial Cu6Sn5 and Ni3Sn4 form during immersing soldering at the Sn/Cu and Sn/Ni interfaces, and both transform into (Cu,Ni)6Sn5, their morphologies change from scallop shape to rod shape. With increasing reaction time, the interfacial IMCs remain as (Cu,Ni)6Sn5, while their morphologies become more uneven. The IMCs at the Sn/Cu and Sn/Ni interfaces grow thicker with increasing reaction time, and their growth indexes are 0.32 and 0.61, respectively. At the beginning of the liquid-solid reaction, the Sn/Cu interfacial IMC is thicker than the Sn/Ni interfacial IMC. However, after liquid-solid reaction for 2 h, the result reverses due to the Cu-Ni cross-solder interaction, and the thicknesses reach 15.78 and 23.44 μm after reaction for 6 h, respectively.
Key words: Cu-Ni cross-solder interaction; Cu/Sn/Ni solder joint; liquid-solid interfacial reaction; intermetallic compound
