(1. 華南理工大學(xué) 發(fā)光材料與器件國家重點實驗室，廣州 510640；
2. 華南理工大學(xué) 材料科學(xué)與工程學(xué)院，廣州 510640)
摘 要: 采用模壓成型和無壓浸滲工藝制備了高體積分?jǐn)?shù)SiC增強Al基復(fù)合材料(AlSiC)，對其物相和顯微結(jié)構(gòu)進行研究。結(jié)果表明：用上述方法制備的AlSiC復(fù)合材料組織致密，兩種粒徑的SiC顆粒均勻分布于Al基質(zhì)中，界面結(jié)合強度高；SiC增強顆粒與Al基質(zhì)界面反應(yīng)控制良好，未出現(xiàn)Al4C3等脆性相。分析指出：Al合金中Si元素的存在有利于防止脆性相Al4C3 的形成，Mg元素的加入提高了Al基體和SiC增強體之間的潤濕性。所獲得復(fù)合材料的平均熱膨脹系數(shù)為9.31×10-6 K-1，熱導(dǎo)率為238 W/(m?K)，密度為2.97 g/cm3，表現(xiàn)出了良好的性能，完全滿足高性能電子封裝材料的要求。
關(guān)鍵字: AlSiC；顯微結(jié)構(gòu)；物相；界面；熱膨脹系數(shù)
（1. State Key Laboratory of Luminescent Materials and Devices, South China University of Technology,
Guangzhou 510640, China;
2. School of Materials Science and Engineering, South China Univ）
Abstract:The SiC reinforced Al matrix composite (AlSiC) with high SiC volume fraction was prepared by combination of compression molding for SiC preform and pressureless infiltration. The microstructure and phase of AlSiC composite were studied. The results show that the AlSiC composite fabricated by above-mentioned methods is free of porosity, the SiC particles with two sizes are distributed uniformly, and the high interfacial bonding strength is achieved. Moreover, the interfacial reaction is well controlled so that some harm phases especially Al4C3 fragility phase are absence from interfacial reaction products. The physical mechanism behind those experimental phenomena was analyzed in detail. The existence of silicon in the aluminum alloy prevents the formation of Al4C3 fragility phase and the addition of magnesium to the aluminum alloy significantly improves the wetting property of SiC with aluminum. The thermal expansion coefficient of AlSiC composite is 9.31×10-6 K-1, the thermal conductivity is 238 W/(m?K), and the density is 2.97 g/cm3. The AlSiC composite exhibits excellent properties and can fully meets the requirements of high-end electronic packaging materials.
Key words: AlSiC; microstructure; phase; interface; thermal expansion coefficient
