(北京科技大學(xué) 腐蝕與防護(hù)中心，北京 100083)
摘 要: 采用掃描Kelvin探針測(cè)試技術(shù)研究噴錫處理(Hot air solder level，HASL)印制電路板(Printed circuit board，PCB)在霉菌環(huán)境下的腐蝕行為；采用通過(guò)體視學(xué)顯微鏡、掃描電鏡和能譜分析對(duì)印制電路板的霉菌生長(zhǎng)和腐蝕情況進(jìn)行觀察和分析。掃描電鏡和能譜結(jié)果表明，在濕熱環(huán)境下，繩狀青霉在噴錫處理PCB表面具有優(yōu)先生長(zhǎng)特性，表現(xiàn)為簇狀菌絲體交織覆蓋。PCB表面腐蝕產(chǎn)物脫落，出現(xiàn)漏銅現(xiàn)象。掃描Kelvin探針結(jié)果分析表明，噴錫處理PCB表面霉菌菌落區(qū)域作為腐蝕電池的陰極受到保護(hù)，而菌落邊緣區(qū)域作為陽(yáng)極發(fā)生腐蝕；掃描Kelvin探針測(cè)試技術(shù)可以用來(lái)表征霉菌環(huán)境下的印制電路板腐蝕行為，表征微區(qū)電極反應(yīng)類(lèi)型和腐蝕進(jìn)程。
關(guān)鍵字: 印制電路板；霉菌；腐蝕行為；掃描Kelvin探針；噴錫處理
（Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China）
Abstract:The corrosion behavior of hot air solder level (HASL) finished printed circuit board (PCB) in the mold environment was studied by scanning Kelvin probe (SKP) technology. The mold growth behavior was observed by stereo microscope and SEM, and the corrosion product was analyzed by EDS. The results of SEM and EDS show that Penicillium funiculosum has a priority growth characteristics and tufted mycelium coverage on the surface of PCB-HASL specimens under hydrothermal condition, and corrosion product strips off and basal copper leakage appears. SKP results show that the corrosion process of fungal colony area is inhibited as the cathode of corrosion cell, and is accelerated as the anode at the edge of the area. SKP technology can be used to characterize the corrosion behavior of PCB in the mold environment and monitor the micro-type of electrode reaction and corrosion process.
Key words: printed circuit board; mold; corrosion behavior; scanning Kelvin probe; hot air solder level
