(哈爾濱理工大學(xué) 材料科學(xué)與工程學(xué)院，哈爾濱 150040)
摘 要: 研究SAC305/Ni界面在260 ℃下液態(tài)保溫、150 ℃下固態(tài)時(shí)效的鍍Ni層消耗及界面IMC的生長規(guī)律。將數(shù)據(jù)擬合，建立液態(tài)保溫、固態(tài)時(shí)效下鍍Ni層消耗及界面IMC生長的數(shù)值模型。結(jié)果表明：焊點(diǎn)在液態(tài)保溫條件下，停留時(shí)間從1 min到50 min，鍍Ni層消耗量與停留時(shí)間t0.2217呈正比關(guān)系，界面IMC生長厚度與停留時(shí)間t0.3494呈正比關(guān)系。在固態(tài)時(shí)效條件下，時(shí)效時(shí)間從168 h到672 h，鍍Ni消耗量與時(shí)效時(shí)間t1/2呈正比關(guān)系，界面IMC生長厚度與時(shí)效時(shí)間t1/2呈正比關(guān)系。與固態(tài)時(shí)效界面IMC生長相比，液態(tài)保溫下的界面IMC生長更加迅速。為了減少鍍Ni層的消耗，避免形成過厚的IMC層，準(zhǔn)確控制液態(tài)停留時(shí)間是十分重要的。
關(guān)鍵字: 液態(tài)保溫；固態(tài)時(shí)效；鍍Ni層消耗；IMC生長；演變規(guī)律
（School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China）
Abstract:The evolution of interfacial IMC and the consumption of Ni plated layer of the SAC305/Ni joint during liquid insulation at 260 ℃and solid aging at 150 ℃ were investigated. Numerical models of Ni layer consumption and interfacial IMC growth under the condition of liquid thermal insulation and solid aging were established by fitting the data. The experimental results show that during the liquid holding time is between 1 to 50 min, the consumption of Ni layer is proportional to the holding time t0.2217 and the growth thickness of interfacial IMC is proportional to the holding time t0.3494. During the solid aging time is from 168 h to 672 h. The consumption of Ni is proportional to the aging time t1/2. The growth thickness of interfacial IMC is proportional to the aging time t1/2. Compared with the interface IMC growth under solid aging, the interface IMC growth under liquid insulation is faster. In order to reduce the consumption of the Ni layer and avoid the formation of an excessive thick IMC layer, it is particularly important to control the liquid holding time accurately.
Key words: liquid insulation; solid aging; Ni layer consumption; intermetallic compounds growth; evolution law
