(昆明理工大學(xué) 機電工程學(xué)院，昆明 650500)
摘 要: 為深入理解單晶鍺的納米切削特性，提高納米鍺器件的光學(xué)表面質(zhì)量，使用納米劃痕儀對單晶鍺進行多次刻劃實驗研究，并測得其在刻劃過程中的切削力、摩擦因數(shù)。利用掃描電子顯微鏡(SEM)觀測溝槽的顯微形貌及切屑堆積情況，使用原子力顯微鏡(AFM)檢測其多次刻劃過程中的彈性模量及表面粗糙度。結(jié)果表明：隨著刻劃次數(shù)的增多，切削力、摩擦因數(shù)，表面粗糙度均在逐漸增大，而彈性模量在逐漸變小，這些現(xiàn)象產(chǎn)生的根本原因是在刻劃過程中位錯的產(chǎn)生及單晶鍺晶格遭到破壞引起的能量波動。此外，隨著刻劃次數(shù)的增加，溝槽兩側(cè)的切屑堆積越來越明顯。
關(guān)鍵字: 單晶鍺；多次刻劃；切削力；彈性模量
（Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming 650500, China）
Abstract:In order to understand the nanoscale cutting characteristics of single crystal germanium and improve the optical surface quality of the nanoscale germanium, the nanoscratch instrument was used to study the single crystal germanium, and the cutting force and friction coefficient in the process were measured. Scanning electron microscope (SEM) was used to observe the micromorphology and chip accumulation of the grooves. The elastic modulus and surface roughness were measured by atomic force microscopy (AFM). The results show that the cutting force, the friction coefficient and the surface roughness increase with the increase of the number of stroke, and the modulus of elasticity decreases gradually. The root cause of these phenomena is due to the dislocation in the etching process and the energy fluctuation caused by the destruction of the single crystal germanium lattice. In addition, with the increase of the number of chips, the accumulation of chips on both sides of the groove is more and more obvious.
Key words: single crystal germanium; multiple characterization; cutting force; elastic modulus
