(1. 重慶大學 材料與科學工程學院，重慶 400044；
2. 北京航空航天大學 儀器科學與光電工程學院，北京 100191；
3. 重慶大學 電子顯微鏡中心，重慶 400044)
摘 要: 將87%周向軋制鉭板分別加熱至700、800和900 ℃進行預回復處理，隨后，將所有樣品在1300℃保溫30 min進行再結(jié)晶退火處理。應(yīng)用X射線峰形分析(XLPA)定量計算經(jīng)不同溫度預回復處理后樣品1/4厚度層的儲存能。此外，利用電子背散射衍射(EBSD)和透射電子顯微(TEM)技術(shù)表征了預回復和再結(jié)晶態(tài)樣品的微觀組織。結(jié)果表明：隨著預回復溫度的升高，一方面，亞晶數(shù)目逐漸增加；另一方面，{111}(111//ND(板法向))和{100}(100//ND)取向晶粒內(nèi)部的儲存能明顯減小，且兩者的比值也逐漸降低。因此，再結(jié)晶晶粒尺寸不斷減小且晶粒形貌也趨近等軸狀。但過高的預回復溫度(900 ℃)使后續(xù)再結(jié)晶組織中出現(xiàn)了較強的{111}織構(gòu)帶，經(jīng)過800℃預回復處理后的再結(jié)晶微觀組織相對較為均勻，最有利于鉭濺射靶材的應(yīng)用。
關(guān)鍵字: 高純鉭；周向軋制；預回復溫度；儲存能；微觀組織
（1. College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China;
2. School of Instrument Science and Opto-electronics, Beihang University, Beijing 100191, China;
3. Electron Microscopy Center of Chongqing University, Chongqing University, Chongqing 400044, China）
Abstract:High-purity tantalum plates were clock rolled to 87% reduction in thickness. Then, the samples were heated up to 700, 800 and 900 ℃ in the furnace, respectively, and were all annealed at 1300 ℃ for 30 min to get the recrystallization microstructure. X-ray line profile analysis (XLPA) was adopted to quantify the bulk stored energy of a quarter of the thickness of tantalum plates at different pre-recovery temperatures, combing with the electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM) to characterize the pre-recovery and recrystallization microstructure. The results show that the number of subgrains increases gradually with the increase of pre-recovery temperature and the stored energy gap of {111} ([111]//ND, ND is normal direction) and {100} ([100]//ND) orientation grain decreased obviously, which effectively reduces the subsequent driving force of recrystallization. Therefore, the recrystallization grain size gradually decreases and the grain morphology is close to be equiaxed. However, the high pre-recovery temperature (900 ℃) leads to a strong {111} texture bands in recrystallization microstructure, while the recrystallization microstructure is relatively uniform through pre-recovering of 800 ℃, which is beneficial to the application of tantalum sputtering target.
Key words: high-purity tantalum; clock rolled; pre-recovery temperature; stored energy; microstructure
