(1. 合肥工業(yè)大學(xué) 工業(yè)與裝備技術(shù)研究院，合肥 230009；
2. 合肥工業(yè)大學(xué) 材料科學(xué)與工程學(xué)院，合肥 230009；
3. 有色金屬與加工技術(shù)國家地方聯(lián)合工程研究中心，合肥 230009；
4. 安徽省有色金屬材料與加工工程實驗室，合肥 230009)
摘 要: 采用放電等離子燒結(jié)技術(shù)制備高體積分數(shù)SiCp/Al復(fù)合材料，研究SiC顆粒級配對復(fù)合材料微觀結(jié)構(gòu)、熱和力學(xué)性能的影響。結(jié)果表明：放電等離子燒結(jié)制備的SiCp/Al復(fù)合材料由SiC和Al兩相組成，SiC顆粒基本呈均勻隨機分布、層次明顯，SiC顆粒與Al基體界面結(jié)合強度高且無Al4C3等脆性相生成。在雙粒徑級配的SiCp/Al復(fù)合材料中，SiC體積分數(shù)從50%增加到65%時，其相對密度從99.93%下降到96.40%；其中，當(dāng)SiC體積分數(shù)為60%時，復(fù)合材料的相對密度、熱導(dǎo)率、平均熱膨脹系數(shù)(50~400 ℃)和抗彎強度分別為99.19%、227.5 W/(m·K)、9.77×10-6 K-1和364.7 MPa。
關(guān)鍵字: SiCp/Al復(fù)合材料；放電等離子燒結(jié)；顆粒級配；熱導(dǎo)率；熱膨脹系數(shù)；抗彎強度
（1. Institute of Industry & Equipment Technology, Hefei University of Technology, Hefei 230009, China;
2. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;
3. National-Local Joint Engineering Research Centre of Nonferrous Metals and Processing Technology, Hefei 230009, China;
4. Laboratory of Nonferrous Metal Material and Processing Engineering of Anhui Province, Hefei 230009, China）
Abstract:SiCp/Al composite with high volume fraction of SiC was fabricated by spark plasma sintering. The effects of SiC grain gradation on the microstructure, thermal performance and mechanical properties of composite were investigated. The results show that the SiCp/Al composites are composed of SiC and Al, no reaction product such as Al4C3 fragility phase produces at the interface, and the SiC particles with two sizes distribute uniformly and randomly. The relative density of the composites containing bimodal SiC particles decreases from 99.93% to 96.4% with increasing the volume fraction of SiC from 50% to 65%. Relative density, thermal conductivity, average thermal expansion coefficient (50-400 ℃), and the bending strength of the composite containing 60% bimodal SiC particles are 99.19%, 227.5 W/(m·K), 9.77×10-6 K-1 and 364.7 MPa, respectively.
Key words: SiCp/Al composites; spark plasma sintering; grain gradation; thermal conductivity; thermal expansion coefficient; bending strength
