(1. 北京科技大學(xué) 材料科學(xué)與工程學(xué)院，北京 100083； 2. 北京科技大學(xué) 新興產(chǎn)業(yè)技術(shù)研究院，北京 100083)
摘 要: 采用高性價比液固分離法(LSS)制備高性能金剛石/鋁散熱基板，研究金剛石鍍銅對復(fù)合材料界面結(jié)合和導(dǎo)熱性能的影響，利用SEM、EMPA、XRD分析復(fù)合材料的斷口形貌及界面行為。結(jié)果表明：鍍層元素向基體擴散與基體鋁形成Al2Cu4化合物，中間相增強兩相界面結(jié)合，改善材料性能。金剛石鍍銅處理后，復(fù)合材料致密度提高1.16%，熱導(dǎo)率提高9.50%，抗拉強度提高17.39%，復(fù)合材料的熱物理性能優(yōu)于CE13合金的。用Maxwell、Kerner理論模擬預(yù)測熱導(dǎo)率(TC)、熱膨脹系數(shù)(CTE)與實際測量結(jié)果相一致。
關(guān)鍵字: 金剛石/鋁復(fù)合材料；液固分離法；鍍層；熱導(dǎo)率；熱膨脹系數(shù)；電子封裝
（1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; 2. Institute of Emerging Technology and Industry, University of Science and Technology Beijing, Beijing 100083, China）
Abstract:High performance diamond/Al composites for heat dissipation were manufactured by advanced cost-effective liquid-solid separation (LSS) technology. The effect of Cu coating on the interface bonding and thermal conductivity of composite materials were researched. The fracture morphology and interfacial behavior of composite materials were analyzed by SEM, EMPA and XRD. The result show that the Al2Cu4 compounds form from coating element diffuse and Al matrix, which can enhance the interfacial bonding between the two phases and improve the properties of the materials. After Cu coating, the density of the composites increases by 1.16%, the thermal conductivity increases by 9.50%, the tensile strength increases by 17.39%. The thermal physical properties of Cu-diamond/Al are better than that of CE13 (controlled expansion) alloy. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion of diamond/Al composites show the similar tendency with those by Maxwell and Kerner models, respectively.
Key words: diamond/Al composites; liquid-solid separation technology; coating; thermal conductivity; coefficient of thermal expansion; electronic packaging
