(1. 合肥工業(yè)大學 材料科學與工程學院，合肥 230009；
2. 合肥工業(yè)大學 安徽省粉末冶金工程技術研究中心，合肥 230009)
摘 要: 以硝酸銅、石墨為原料，采用新穎的凝膠澆注法制備納米銅粉，并利用硅烷偶聯(lián)劑KH550對制備的納米銅粉進行表面抗氧化處理；然后以納米銅粉為導電填料、以雙酚A型環(huán)氧樹脂(E51)為載體，加入適量的固化劑和稀釋劑、除泡劑、促進劑等制備納米銅粉導電膠。采用X射線衍射(XRD)和透射電鏡(TEM)等對制備銅粉的物相、粒度和形貌等進行表征；對預處理前后的納米銅粉進行熱重與差熱(TG-DSC)分析；并研究納米銅粉添加量對所制備導電膠電阻率和連接強度等性能的影響。結(jié)果表明：采用凝膠澆注法可制備高純度、分散性良好、平均粒度約為60 nm的類球形銅粉；經(jīng)硅烷偶聯(lián)劑處理后，納米銅粉的抗氧化性能明顯提高；納米銅粉添加量對所得導電膠的體積電阻率和連接強度有較大影響，納米銅粉添加量為60%(質(zhì)量分數(shù))的導電膠的體積電阻率為1.7×10-3 Ω·cm，連接強度為11.4 MPa。
關鍵字: 納米銅粉；凝膠澆注法；導電膠；電阻率；連接強度
（1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;
2. Research Center for Powder Metallurgy Engineering and Technology of Anhui Province,
Hefei University of Technology, Hefei 230009, China）
Abstract:Nano-sized copper powders were prepared by gel-casting method using copper nitrate and graphite as the main raw materials. Silane coupling agent KH550 was used in the surface antioxidant treatment of copper powders. Using the as-prepared nano-sized copper powders as conductive fillers and the bisphenol A epoxy resins (E51) as matrix, nano-copper filled conductive adhesives were prepared by adding appropriate amount of curing agent, thinner, defrother, promoter and other additive agents. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were used to characterize the phase composition, particle size and morphology of the copper powders. The copper powders before and after anti-oxidation treatment was conducted by TG-DSC analysis. The influence of the nano-sized copper powder content on the resistivity and bonding strength of the adhesives was investigated. The results show that the copper powders prepared by gel-casting method are of high purity, well dispersibility and a mean particle size of about 60 nm. After being treated by silane coupling agent, the oxidation property of the nano-sized copper powders can be obviously improved. The content of nano-sized copper powders has a great effect on the volume resistivity and bonding strength of the conductive adhesives, the optimum sample with volume resistivity of 1.7×10-3 Ω·cm and bonding strength of 11.4 MPa can be prepared when the filling amount of nano-sized copper powders is 60% (mass fraction).
Key words: nano-sized copper powder; gel-casting method; conductive adhesive; resistivity; bonding strength
