(銀邦金屬復合材料股份有限公司 江蘇省金屬層狀復合材料重點實驗室，無錫 214145)
摘 要: 采用金相顯微鏡、掃描電鏡和X射線衍射儀，研究電站空冷用鋁(4A60)-鋼(08Al)復合帶材在不同模擬釬焊工藝下界面化合物的生長特性。通過界面剝離實驗，分析不同釬焊條件下復合帶材結(jié)合性能的變化規(guī)律。結(jié)果表明：在釬焊保溫時間20 min內(nèi)，鋁(4A60)-鋼(08Al)復合帶材生成界面金屬間化合物(IMC)的臨界溫度范圍為605~615 ℃，界面相主要成分為Fe2Al5。界面金屬間化合物厚度隨保溫時間的增長滿足拋物線規(guī)律，在615 ℃時，生長常數(shù)k為0.69×10-12 m2/s。界面金屬間化合物厚度在12 μm以下時，復合帶材仍保持良好的界面結(jié)合強度(大于45 MPa)。隨著金屬間化合物厚度繼續(xù)增加，界面結(jié)合強度顯著下降，當金屬間化合物厚度為25~43 μm時，結(jié)合強度降至10~20 MPa；當金屬間化合物厚度為54~68 μm時，界面結(jié)合強度只有5~10 MPa。
關(guān)鍵字: 鋁(4A60)-鋼(08Al)復合帶材；金屬間化合物；生長動力學；結(jié)合性能
（Jiangsu Key Laboratory for Clad Materials, Yin Bang Clad Material Co., Ltd., Wuxi 214145, China）
Abstract:The growth characteristics of intermetallic compound (IMC) at the interface of Al(4A60)-steel(08Al) clad strip applied for air cooling at power station with different simulated brazing processes were investigated by metallographic microscopy, scanning electron microscopy, X-ray diffractometry. And the bonding properties of clad strip were studied through tensile peeling test. The results show that the critical forming temperature of IMC is 605-615 ℃ when the holding time is less than 20 min, and the composition of the IMC is Fe2Al5. As the holding time increases, the growth of IMC meets the parabolic relationship. The growth constant k is 0.69×10-12 m2/s while the annealing temperature is 615 ℃. When the IMC thickness is less than 12 μm, the interface bonding strength of clad strip still remains well (＞45 MPa). As the thickness of IMC increases, the bonding strength of the interface decreases rapidly. When the thickness of IMC is 25-43 μm, the bonding strength of the interface decreases to 10-20 MPa. When the thickness of IMC is 54-68 μm, the bonding strength of the interface is only 5-10 MPa.
Key words: Al(4A60)-steel(08Al) clad strip; intermetallic compound; growth kinetics; bonding property
