(東北大學(xué) 材料與冶金學(xué)院，沈陽 110819)
摘 要: 基于田口方法，提出微波浸出銅陽極泥的優(yōu)化方法，并對銅、碲、硒的浸出率進行信噪比分析。結(jié)果表明，固液比對銅、碲、硒浸出率的貢獻率最大，貢獻率分別達到60.83%、54.76%和62.05%。固液比是銅陽極泥微波浸出過程最重要的工藝參數(shù)，時間對于銅、碲浸出率為較重要因素，酸濃度對于硒浸出率為較重要因素，微波功率對于銅、碲、硒浸出率的貢獻率都較小，分別為4.23%、12.37%和10.32%。銅浸出最優(yōu)條件如下：微波功率450 W、時間5 min、固液比0.10 g/mL、酸濃度1.0 mol/L；碲、硒浸出最優(yōu)條件如下：微波功率700 W、時間9 min、固液比0.10 g/mL、酸濃度1.0 mol/L。在優(yōu)化后的工藝條件下進行驗證實驗，銅浸出率達到99.88%以上，碲浸出率達到95.70%以上，硒浸出率達到38.22%以上。
關(guān)鍵字: 銅陽極泥；田口法；微波；信噪比
（School of Materials and Metallurgy, Northeastern University, Shenyang 110819, China）
Abstract:An optimization method of microwave assisted leaching of copper anode slime was proposed based on Taguchi method for signal noise ratio (SNR) and variance analysis of the copper, tellurium and selenium leaching rates. The results shows that the solid-liquid ratio is the most important factor affecting SNR of the copper, tellurium and selenium leaching rates, and its contributions to the copper, tellurium and selenium leaching rates reach 60.83%, 54.76% and 62.05%, respectively. Solid-liquid ratio is a significant factor of the microwave leaching process of copper. Reaction time is a less significant factor of the leaching process of copper and tellurium and concentration of sulphuric acid is a less significant factor of the leaching process of selenium, while microwave power is an non-significant factor, its contributions to the copper, tellurium and selenium leaching efficiency reach 4.23%, 12.37% and 10.32%, respectively. The optimized parameters of the microwave assisted leaching of copper are as follows: microwave power 450 W, reaction period 5min, solid-liquid ratio 0.10 g/mL and concentration of sulphuric acid 1.0 mol/L. The optimized parameters of the microwave assisted leaching of tellurium and selenium are as follows: microwave power 700 W, reaction period 9min, solid-liquid ratio 0.10 g/mL and concentration of sulphuric acid 1.0 mol/L. The validation experiments under the optimized conditions was carried out, the leaching rates of copper, tellurium and selenium reach above 99.88%, 95.70% and 38.22%, respectively.
Key words: copper anode slime; Taguchi methods; microwave; signal noise ratio
