(1. 昆明理工大學(xué) 材料科學(xué)與工程學(xué)院，昆明 650093；
2. 四川理工學(xué)院 機(jī)械工程學(xué)院，自貢 643000)
摘 要: 采用鍛造與重熔加熱的應(yīng)變誘導(dǎo)熔化激活(SIMA)法制備CuSn10P1合金半固態(tài)坯料，先對(duì)CuSn10P1鑄錠進(jìn)行退火處理，再對(duì)其進(jìn)行鍛造變形，然后對(duì)試樣進(jìn)行850及950 ℃保溫5 min-水淬處理，獲得CuSn10P1半固態(tài)坯料。采用金相顯微鏡和掃描電鏡觀察各階段試樣組織形貌，計(jì)算半固態(tài)組織的固相分?jǐn)?shù)，分析變形量和重熔溫度對(duì)CuSn10P1半固態(tài)組織的影響。結(jié)果表明：CuSn10P1合金鑄錠經(jīng)680 ℃、24 h退火后，消除了枝晶組織，獲得了以α相為主的等軸晶組織。CuSn10P1合金半固態(tài)組織固相分?jǐn)?shù)隨變形量的增加而降低，當(dāng)變形量從8.4%增加至21.9%經(jīng)850 ℃重熔時(shí)，固相分?jǐn)?shù)從70.15%降低至57.83%；950 ℃重熔時(shí)，固相分?jǐn)?shù)從58.79%降低至53.10%。重熔溫度越高，變形量對(duì)固相分?jǐn)?shù)變化程度影響越小。
關(guān)鍵字: CuSn10P1合金；應(yīng)變誘導(dǎo)熔化激活法；變形量；固相分?jǐn)?shù)；微觀組織
（1. Faculty of Materials Science and Engineering, Kunming University of Science and Technology,
Kunming 650093, China;
2. College of Mechanical Engineering, Sichuan University of Science and Engineering, Zigong 643000, China）
Abstract:Semi-solid CuSn10P1 alloy billets were fabricated by strain induced melt activation (SIMA) method including the forging and remelting processes. Firstly, CuSn10P1 billets were annealed and forged. Secondly, the billets were reheated to 850℃ or 950℃, and hold for 5 min. Finally, the billets were water quenched, and semi-solid microstructures of CuSn10P1 alloy were obtained. The microstructures of semi-solid CuSn10P1 alloy with different stages were observed by OM and SEM. The solid fractions of the semi-solid microstructure were computed. The effects of deformation and remelting temperature on the microstructures of semi-solid CuSn10P1 alloy were investigated. The results indicate that dendritic structure of CuSn10P1 billets is eliminated, and equiaxed grains of α phase are obtained after annealing at 680 ℃ for 24 h. The solid fraction of semi-solid CuSn10P1 microstructure decreases with the increase of the deformation. With the increase of the deformation from 8.4% to 21.9%, the solid fraction decreases from 70.15% to 57.83% by remelting at 850 ℃, and the solid fraction decreases from 58.79% to 53.10% by remelting at 950 ℃. The higher the remelting temperature is, the smaller the effect of deformation on solid fraction is.
Key words: CuSn10P1 alloy; strain induced melt activation; deformation; solid fraction; microstructure
