(1. 重慶理工大學(xué) 材料科學(xué)與工程學(xué)院，重慶 400054；
2. 北京科技大學(xué) 新金屬材料國(guó)家重點(diǎn)實(shí)驗(yàn)室，北京 100083)
摘 要: 采用攪拌輔助低溫(半固態(tài)區(qū)間)釬焊技術(shù)，制備低銀無(wú)鉛釬料和納米復(fù)合釬料釬焊接頭。結(jié)果表明：240 ℃時(shí)復(fù)合釬料的潤(rùn)濕時(shí)間較基體的潤(rùn)濕時(shí)間縮短了31%，潤(rùn)濕力較基體的提高了3.8%；機(jī)械攪拌在破碎樹枝晶和加速元素?cái)U(kuò)散的同時(shí)，降低了液相的溫度梯度和成分過(guò)冷，大大削弱了釬料基體中金屬間化合物(IMC)Cu6Sn5的枝晶生長(zhǎng)，促使針狀Cu6Sn5破碎呈短棒狀；在低銀無(wú)鉛釬料中加入納米Ni顆粒，Ni與Cu6Sn5生成孔洞狀化合物(CuxNi1-x)6Sn5及低溫?cái)嚢栊纬傻臍饪壮蔀榻缑嬖拥臄U(kuò)散通道。攪拌形成的紊流和熱流傳遞加快了原子的溶解與擴(kuò)散，加速了界面IMC的生長(zhǎng)。
關(guān)鍵字: 納米Ni增強(qiáng)Sn-Cu-Ag復(fù)合釬料；低溫釬焊；攪拌；潤(rùn)濕性；金屬間化合物
（1. School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;
2. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing,
Beijing 100083, China）
Abstract:The soldering joints of low silver solder and nano-particle lead-free Sn-Cu-Ag composite solder were prepared by the technology of low-temperature soldering (at semi-solid state) with stirring, respectively. The results show that the wetting time of nano-particle composite solder is decreased by 31% at 240 ℃, and the wetting power is increased by 3.8% compared those of with the matrix. Mechanical mixing can break dendrites and accelerate the diffusion of elements, and also reduce the temperature gradient and the composition undercooling of the liquid, thus, greatly weaken the growth of IMC-Cu6Sn5 dendrite in solder matrix and making needle-shaped intermetallic compound (IMC) Cu6Sn5 break into short rod-like. After adding nano-Ni particles into the low silver solder, cavitary compounds of (CuxNi1-x) 6 Sn5 generated by Ni with Cu6Sn5 and the porosities formed by stirring at low temperature are as the diffusion path of interface atoms. The turbulent flow and heat flow due to stirring accelerate the dissolution and diffusion of the atom, and speed up the growth of IMC.
Key words: nano-Ni particle Sn-Cu-Ag composite solders; low-temperature soldering; stirring; wettability; intermetallic compound
