Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學(xué)報

ZHONGGUO YOUSEJINSHU XUEBAO

第23卷    第1期    總第166期    2013年1月

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文章編號:1004-0609(2013)01-0219-10
基于電磁場與流場耦合的電沉積加工過程仿真
吳蒙華,劉新功,王元剛,賈衛(wèi)平

(大連大學(xué) 機械工程學(xué)院,大連 116622)

摘 要: 在電沉積過程中運用COMSOL Multiphysics建立電磁場、流場的數(shù)學(xué)模型,將有限元和有限差分相結(jié)合進行電磁場和流場的耦合模擬分析,研究磁場對流場、電流密度分布、鍍層表面形貌、晶粒及SiC含量的影響規(guī)律,并進行預(yù)測與驗證。結(jié)果表明:施加平行磁場時,磁感應(yīng)強度在極頭之間分布均勻,溶液呈現(xiàn)不規(guī)則的運動,鍍層厚度預(yù)測值的最小誤差為1.84%,鍍層的晶粒尺寸隨著磁感應(yīng)強度的增大而細化;施加垂直磁場時,兩極頭間區(qū)域的磁感應(yīng)強度較強,溶液呈現(xiàn)漩渦流動,且流速隨磁場感應(yīng)強度的增大而增大。XRD分析表明:在所研究磁感應(yīng)強度范圍內(nèi)磁場對晶粒的取向沒有明顯的影響,鍍層中SiC含量隨著磁感應(yīng)強度的增大而增加。

 

關(guān)鍵字: 磁場;流場;耦合;電沉積;數(shù)值分析

Simulation of electrodeposition process based on electromagnetic coupling with flow field
WU Meng-hua, LIU Xin-gong, WANG Yuan-gang, JIA Wei-ping

College of Mechanical Engineering, Dalian University, Dalian 116622, China

Abstract:The mathematical models of the electromagnetic field and the flow field in process of electrode positions were established by COMSOL Multiphysics. The simulation analysis of coupling electromagnetic field and flow field was realized by combining finite element and finite difference. The influences of the magnetic field on the flow field, distribution of current density, morphology of coating surface, grain size and SiC content were studied. The prediction and validation were conducted. The results show that the magnetic flux density between the poles is uniform distribution and the solution appears irregular movement in the parallel magnetic field, and the predictive value of minimum error of coating thickness is 1.84%. The grain size of coating is refinement with the increase of magnetic flux density. The magnetic flux density between the poles is stronger, and the solution presents the swirl flow and the flow rate increases with the magnetic flux density increasing in the vertical magnetic field. It is obtained by XRD analysis that the magnetic field has no significant impact on the grain orientation in the studied range of magnetic flux density. The SiC content in the coating increases with the magnetic flux density increasing.

 

Key words: magnetic field; flow field; coupling; electrodeposition; numerical analysis

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學(xué)技術(shù)協(xié)會 主辦:中國有色金屬學(xué)會 承辦:中南大學(xué)
湘ICP備09001153號 版權(quán)所有:《中國有色金屬學(xué)報》編輯部
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