(北京有色金屬研究總院，國(guó)家有色金屬?gòu)?fù)合材料工程技術(shù)研究中心，北京 100088)
摘 要: 采用熱等靜壓(HIP)技術(shù)制備50Sip/Al-Cu和70Sip/Al-Cu復(fù)合材料(50Sip/Al-4.0Cu和70Sip/Al-4.0Cu，Si含量為體積分?jǐn)?shù)，Cu的質(zhì)量分?jǐn)?shù)為4.0%)，利用XRD和掃描電鏡研究熱等靜壓態(tài)樣品的相組成和組織形貌，并測(cè)試其主要物理和力學(xué)性能。結(jié)果表明：材料完全致密、Si顆粒在Al基體中分布均勻且組織細(xì)小；熱等靜壓態(tài)的50Sip/Al-Cu和70Sip/Al-Cu復(fù)合材料的熱膨脹系數(shù)分別為12.7×10−6和8.7×10−6 K−1，抗彎強(qiáng)度分別為395和350 MPa，熱處理后的材料強(qiáng)度拉彎可進(jìn)一步提高至548和397 MPa，與采用其他技術(shù)制備的同類材料相比，熱等靜壓制備的Sip/Al-Cu復(fù)合材料在保持低膨脹系數(shù)的同時(shí)具有更高的抗彎強(qiáng)度及其他力學(xué)性能。
關(guān)鍵字: Sip/Al-Cu；熱等靜壓；顆粒增強(qiáng)復(fù)合材料；熱膨脹系數(shù)；力學(xué)性能
（National Engineering Technology Center for Nonferrous Metal Composites,
General Research Institute for Non-ferrous Metals, Beijing 100088, China）
Abstract:The Al alloy matrix composites reinforced by silicon particles (50% and 70%Sip/Al-4.0Cu, Si content in volume fraction and Cu content of 4% in mass fraction) were prepared by hot-isostatic pressing (HIP). The microstructure of the composites was investigated by XRD and scanning electron microscopy. The mechanical and thermal properties of the composites were tested. The results show that the prepared Si/Al-Cu composites are fully dense. The silicon particles well distribute in Al matrix. The coefficients of thermal expansion (CTE) of as-HIPed 50Sip/Al-Cu and 70Sip/Al-Cu composites are 12.7×10−6 and 8.7×10−6K−1. The three-point bending of the as-HIPed 50Sip/Al-Cu and 70Sip/Al-Cu composites are 395 and 350MPa, which can be improved to 548 and 397MPa through the heat treatment. The Sip/Al -Cu composites prepared by the hot isostatic pressing route show remarkably enhanced strength, especially keep low coefficient of thermal expansion and low density compared with the similar materials prepared by other methods.
Key words: Sip/Al-Cu; hot isostatic pressing; particulate composites; coefficient of thermal expansion; mechanical properties
