Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學(xué)報(bào)

ZHONGGUO YOUSEJINSHU XUEBAO

第22卷    第10期    總第163期    2012年10月

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文章編號(hào):1004-0609(2012)10-2805-06
快速凝固對(duì)Sn-6.5Zn釬料合金特性及釬料/Cu焊點(diǎn)力學(xué)性能的影響
趙國際,盛光敏,羅  軍

(重慶大學(xué) 材料科學(xué)與工程學(xué)院,重慶 400044)

摘 要: 利用單棍快淬工藝制備快速凝固態(tài)Sn-6.5Zn合金薄帶,對(duì)比分析快速凝固制備工藝對(duì)釬料微觀結(jié)構(gòu)、熔化與鋪展特性的影響,并利用拉伸−剪切試驗(yàn)對(duì)比研究了釬料/Cu焊點(diǎn)力學(xué)性能。結(jié)果表明:快速凝固能夠顯著細(xì)化Sn-6.5Zn合金微觀組織,初生β-Sn相快速分枝并形成網(wǎng)狀枝晶結(jié)構(gòu),Zn相呈尺寸為0.5~2 μm的細(xì)小顆粒分布于β-Sn基體中;經(jīng)快速凝固后,Sn-6.5Zn合金熔化區(qū)間減小了約3.7 ℃;快速凝固態(tài)Sn-6.5Zn合金具有優(yōu)于常態(tài)釬料的釬焊工藝性能,能夠促進(jìn)釬料/Cu焊點(diǎn)形成均勻界面并改善力學(xué)性能。

 

關(guān)鍵字: 快速凝固;Sn-6.5Zn釬料;焊點(diǎn);微觀結(jié)構(gòu);力學(xué)性能

Influence of rapid solidification on characteristics of Sn-6.5Zn solder alloy and mechanical properties of solder/Cu joints
ZHAO Guo-ji, SHENG Guang-min, LUO Jun

College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China

Abstract:The rapidly solidified Sn-6.5Zn alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process on the microstructure, thermodynamic characteristic and spreading properties of Sn-6.5Zn solder alloys were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the solidification structure of Sn-6.5Zn alloy. A netlike dendrite structure is formed due to the rapid branch of β-Sn and the Zn phases are distributed in β-Sn matrix in granular form with size of 0.5−2 μm. After rapid solidification, the pasty range is reduced by about 3.7 ℃. The rapidly solidified Sn-6.5Zn alloy has an excellent wettability under test compared with as-solidified solder. The mechanical properties of solder/Cu joints are also obviously improved by using the rapidly solidified Sn-6.5Zn solder alloy, which results in the formation of uniform interface.

 

Key words: rapid solidification; Sn-6.5Zn solder; soldering joint; microstructure; mechanical properties

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學(xué)技術(shù)協(xié)會(huì) 主辦:中國有色金屬學(xué)會(huì) 承辦:中南大學(xué)
湘ICP備09001153號(hào) 版權(quán)所有:《中國有色金屬學(xué)報(bào)》編輯部
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