電化學(xué)腐蝕的影響
(1. 沈陽工業(yè)大學(xué) 材料科學(xué)與工程學(xué)院，沈陽 110023；
2. 遼寧石油化工大學(xué) 機(jī)械工程學(xué)院，撫順 113001)
摘 要: 運(yùn)用X射線衍射儀、掃描電鏡、電化學(xué)測(cè)試系統(tǒng)等研究0.125 T的靜態(tài)磁場(chǎng)及旋轉(zhuǎn)磁場(chǎng)對(duì)Sn-9Zn釬料的組織及性能影響。結(jié)果表明：靜態(tài)磁場(chǎng)及旋轉(zhuǎn)磁場(chǎng)均可促進(jìn)Sn-9Zn釬料組織細(xì)化，其中旋轉(zhuǎn)磁場(chǎng)可使Zn相分布呈旋轉(zhuǎn)狀；與未經(jīng)磁場(chǎng)作用相比，靜態(tài)磁場(chǎng)和旋轉(zhuǎn)磁場(chǎng)可使Sn-9Zn釬料的顯微硬度分別提高7.4%和10.2%，達(dá)到18.8 HV和19.3 HV；此外，經(jīng)靜態(tài)磁場(chǎng)及旋轉(zhuǎn)磁場(chǎng)作用的釬料的腐蝕電位分別為−1.428和−1.450 V，比Sn-9Zn釬料的有所降低，而腐蝕電流密度分別為1.424×10−8和2.538×10−9 A/m2，相比Sn-9Zn釬料，其腐蝕電流密度明顯減小，釬料腐蝕性能得到改善。
關(guān)鍵字: 金屬材料；Sn-9Zn釬料；錫合金；磁場(chǎng)；組織；顯微硬度；電化學(xué)腐蝕
microhardness and electrochemical corrosion of Sn-9Zn solder
（1. School of Materials Science and Engineering, Shenyang University of Technology, Shenyang 110023, China;
2. School of Mechanical Engineering, Liaoning Shihua University, Fushun 113001, China）
Abstract:The microstructure and property of Sn-9Zn solder were investigated under static magnetic field and rotary magnetic field of 0.125 T by XRD, SEM and electrochemical detector system. The results show that both static magnetic field and rotary magnetic field can refine the microstructure of Sn-9Zn solder, and Zn phase is rotating as well, the microhardness of Sn-9Zn solder under static magnetic field and rotary magnetic field increase by 7.4% and 10.2%, reaching to 18.8 HV and 19.3 HV, respectively, compared with the solder without magnetic field. While the corrosion potential of the solder under static magnetic field and rotary magnetic field decrease slightly and the corrosion current density obviously declines, which improves the solder corrosion property.
Key words: metallic materials; Sn-9Zn solder; Sn alloy; magnetic field; microstructure; microhardness; electrochemical corrosion
