生長速率的影響
(哈爾濱理工大學(xué) 材料科學(xué)與工程學(xué)院，哈爾濱 150040)
摘 要: 通過加速溫度時效方法研究Ni和Bi元素對低銀 (含銀量小于1%，質(zhì)量分?jǐn)?shù)) Sn-Ag-Cu（LASAC）釬料界面IMC生長速率的影響。通過與高銀釬料SAC305和低銀釬料LASAC對比，分析添加Ni和Bi元素后LASAC釬料在高溫時效過程中熱疲勞抗性的變化情況。結(jié)果表明：LASAC/Cu、LASAC-Bi/Cu和 SAC305/Cu界面IMC時效后均形成較厚的Cu3Sn層，LASAC-Ni/Cu界面經(jīng)IMC時效后則形成較薄的(Cu, Ni)3Sn；高銀釬料SAC305在180 ℃時效下IMC生長速率為2.17×10−5 μm2/s，與之相比，低Ag釬料LASAC IMC在時效過程中生長速率較高，為3.8×10−5 μm2/s；Ni和Bi元素的添加均可降低釬料LASAC/Cu界面IMC的生長速率，其中Bi的改善效果最顯著，LASAC-Bi釬料的IMC生長速率為1.92×10−5 μm2/s，低于SAC305釬料的IMC生長速率。
關(guān)鍵字: 生長速率；界面化合物(IMC)；高溫時效；低銀釬料
（School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China）
Abstract:The effects of Ni and Bi addition on the intermetallic compound (IMC) growth rate of low-Ag (＜1%, mass fraction) Sn-Ag-Cu(LASAC) soldering were investigated by accelerated temperature aging. The thermal fatige resistance of LASAC solders with Ni and Bi addition was studied by comparing with SAC305 solder. The results show that thick Cu3Sn layer forms after high temperature storage (HTS) aging between LASAC/Cu, LASAC-Bi/Cu and SAC305/Cu interfaces. While the IMC between LASAC-Ni/Cu is (Cu, Ni)3Sn layer with a very thin thickness after aged. The IMC growth rate of SAC305 is 2.17×10−5 μm2/s. However, the IMC growth rate of LASAC solder is 3.8×10−5 μm2/s, which is faster than that of SAC305. The growth rate of IMC at LASAC/Cu interface decreases with Ni and Bi addition. Bi shows a better improvement for solder compared with Ni element. The IMC growth rate of LASAC-Bi is 1.92×10−5 μm2/s, which is slower than the IMC growth rate of SAC305.
Key words: growth rate; intermettalic compound (IMC); high temperture storage aging; low-Ag solder
