(中南大學 材料科學與工程學院，長沙 410083)
摘 要: 總結微電子封裝技術對封裝基片材料性能的要求，介紹Al2O3的多晶轉變和典型性能，討論超細Al2O3粉體的3種制備方法：固相法、氣相法和液相法；分析Al2O3陶瓷常用燒結助劑的基本作用和Al2O3陶瓷常用的6種燒結方法：常壓燒結法、熱壓燒結法、熱等靜壓燒結法、微波加熱燒結法、微波等離子燒結法和放電等離子燒結法；指出Al2O3陶瓷基片的發(fā)展方向。
關鍵字: 電子封裝材料；Al2O3陶瓷；超細粉體；燒結助劑；燒結方法
electronic packaging
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The elemental requirements for electronic packaging substrate materials were summarized. The polymorphic transformation and typical properties of alumina were introduced. Three synthesis methods of alumina ultrafine powder were discussed, namely solid phase, gas phase and liquid phase methods. The effect of alumina ceramics sintering additives and six kinds of sintering technologies were analyzed, namely pressureless sintering, hot pressing sintering, high temperature isostatic pressing, microwave sintering, microwave plasma sintering and spark plasma sintering. The development trends of alumina ceramics substrate materials were pointed out.
Key words: electronic packaging materials; alumina ceramics; ultrafine powder; sintering additives; sintering technologies
