(昆明理工大學(xué) 云南省新材料制備與加工重點(diǎn)實(shí)驗(yàn)室，昆明 650093)
摘 要: 用磁控濺射法制備含鉬2.19%~35.15%(摩爾分?jǐn)?shù))的Cu-Mo合金薄膜，運(yùn)用能譜儀(EDX)、X射線(xiàn)衍射儀(XRD)、透射電鏡(TEM)、掃描電鏡(SEM)、顯微硬度儀和電阻計(jì)對(duì)薄膜成分、結(jié)構(gòu)和性能進(jìn)行研究。結(jié)果表明：Mo添加使Cu-Mo薄膜晶粒顯著細(xì)化，Cu-Mo膜呈納米晶結(jié)構(gòu)，存在Mo在Cu中的FCC Cu(Mo)非平衡亞穩(wěn)過(guò)飽和固溶體；隨Mo含量的增加，Mo固溶度逐漸增加，而薄膜微晶體尺寸則逐漸減小，Mo的最大固溶度為30.6%。與純Cu膜對(duì)比表明，Cu-Mo膜的顯微硬度和電阻率隨Mo含量的上升而持續(xù)增加。經(jīng)200、400和650 ℃熱處理1 h后，Cu-Mo膜的顯微硬度和電阻率均降低，降幅與熱處理溫度呈正相關(guān)；經(jīng)650 ℃退火后，Cu-Mo膜基體相晶粒長(zhǎng)大，并出現(xiàn)亞微米−微米級(jí)富Cu第二相。在Cu-Mo膜的XRD譜中觀察到Mo(110)特征峰，Cu-Mo薄膜結(jié)構(gòu)和性能形成及演變的主要原因是添加Mo引起的晶粒細(xì)化效應(yīng)以及熱處理中基體相晶粒的生長(zhǎng)。
關(guān)鍵字: Cu-Mo合金薄膜；納米晶結(jié)構(gòu)；熱處理；顯微硬度；電阻率
magnetron sputtering
（Key Laboratory of Advanced Materials of Yunnan Province, Kunming University of Science and Technology,
Kunming 650093, China）
Abstract:The Cu-Mo alloy thin films with Mo content of 2.19%−35.15% (mole fraction) were prepared by magnetron sputtering. The compositions, structures and properties of thin films were investigated by EDX, XRD, TEM, SEM, microhardness instrument and resistivity meter. The results show that Mo addition refines the grain of Cu-Mo thin films significantly. Cu-Mo thin films possess nanocrystalline structure with the presence of FCC Cu(Mo) nonequilibrium metastable supersaturated solid solution, the Mo solubility gradually increases and the microcrystal size of thin films decreases comparatively with increasing Mo content, and the maximum Mo solubility is 30.6%. The comparison with pure Cu films reveals that both the microhardness and electrical resistivity of Cu-Mo thin films continuously increase with increasing Mo content. After heat-treated at 200, 400 and 650 ℃ for 1 h, the microhardness and resistivity of Cu-Mo coating decrease. The descending range of the microhardness and resistivity are correlated positively with heat treatment temperature. Moreover, the grain of matrix phase grows continuously, and the appearance of submicron-micron Cu-rich second-phase in Cu-Mo films is found, the Mo(110) characteristic peak is observed in Cu-Mo films after annealed at 650 ℃. The formation and evolution of structures and properties of Cu-Mo thin films are mainly contributed to the grain refinement effect caused by Mo addition as well as the growth of matrix phase grain during annealing.
Key words: Cu-Mo alloy thin films; nanocrystalline structure; heat treatment; microhardness; electrical resistivity
