(中國(guó)科學(xué)院 金屬研究所 沈陽材料科學(xué)國(guó)家(聯(lián)合)實(shí)驗(yàn)室，沈陽 110016)
摘 要: 鍍層表面錫晶須自發(fā)生長(zhǎng)是材料科學(xué)中一個(gè)受到長(zhǎng)期關(guān)注的科學(xué)現(xiàn)象。隨著近年來電子器件無鉛化的發(fā)展，錫晶須問題日益突出。對(duì)于高密度電子封裝技術(shù)，由晶須自發(fā)生長(zhǎng)引起的短路和電子故障問題對(duì)電子產(chǎn)品的可靠性構(gòu)成了潛在的威脅。因此，研究錫晶須的生長(zhǎng)規(guī)律，闡明錫晶須的生長(zhǎng)機(jī)理，探尋抑制錫晶須生長(zhǎng)的技術(shù)手段成為當(dāng)前研究的熱點(diǎn)。總結(jié)了近年來國(guó)內(nèi)外對(duì)錫晶須生長(zhǎng)現(xiàn)象的一些相關(guān)研究，主要包括錫晶須的生長(zhǎng)行為、各種影響錫晶須生長(zhǎng)的因素、近年來晶須生長(zhǎng)機(jī)制方面的新進(jìn)展、錫晶須生長(zhǎng)趨勢(shì)的評(píng)估方法以及工業(yè)上抑制晶須生長(zhǎng)的一些技術(shù)措施等。
關(guān)鍵字: 電鍍；錫晶須；生長(zhǎng)機(jī)理；無鉛焊料
tin whisker spontaneous growth on plating surface
（Shenyang National Laboratory for Materials Science, Institute of Metal Research,
Chinese Academy of Sciences, Shenyang 110016, China）
Abstract:The spontaneous growth of tin whiskers on plating surface is a scientific phenomenon which is focused in materials science for long time. With the development of lead-free in electronic devices, the problems resulting from tin whiskers are going up. The spontaneous growth of tin whiskers can cause short-circuit or breakdown of electronic products, which can be the potential problems for the reliability issue of the high density electronic packaging technology. Therefore, it is an important crux to study the influencing factors on whisker growth, seek the way to the mitigation whisker growth and understand the mechanism of whisker growth. The researches and new development on the phenomenon of the tin whisker growth were reviewed, which included the behaviors of tin whisker growth, various influencing factors, recent development in the mechanism of the whisker growth, the evaluation way for whisker growth trend, and some way to the mitigation whisker growth in the industry.
Key words: plating; tin whisker; growth mechanism; lead-free solders
