形態(tài)及對(duì)焊點(diǎn)性能的影響
(1. 重慶大學(xué) 材料科學(xué)與工程學(xué)院，重慶 400044；2. 重慶大學(xué) 機(jī)械傳動(dòng)國(guó)家重點(diǎn)實(shí)驗(yàn)室，重慶 400044；
3. 河南科技大學(xué) 材料科學(xué)與工程學(xué)院，洛陽 471003)
摘 要: 利用SP009A型半自動(dòng)非金屬系制造器，通過銅制單輥快淬工藝制得快速凝固態(tài)Sn2.5Ag0.7Cu釬料合金薄帶，采用JSM−5610LV 掃描電鏡及能譜儀，研究快速凝固態(tài)釬料合金的微觀形貌及金屬間化合物(IMC)特征；通過釬焊接頭組織與剪切斷口分析，研究IMC對(duì)釬焊接頭韌性的影響機(jī)制。結(jié)果表明：快速凝固態(tài)釬料合金焊點(diǎn)界面處形成的排列緊密的小尺寸β-Sn能有效抑制界面處IMC Cu6Sn5的長(zhǎng)大；在釬焊過程中，釬料中過飽和固溶體析出大量尺寸細(xì)小、彌散分布的金屬間化合物Cu6Sn5和Ag3Sn，凝固時(shí)可作為第二相粒子與初生相混雜在一起，形成細(xì)小共晶組織分布于釬縫中，改善了焊點(diǎn)韌性。
關(guān)鍵字: Sn2.5Ag0.7Cu；釬料；金屬間化合物；快速凝固；釬焊
Sn2.5Ag0.7Cu solder alloy and its effects on performance of solder joint
（1. School of Materials Science and Engineering, Chongqing University, Chongqing 400044, China;
2. The State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400044, China;
3. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China）
Abstract:Rapid solidification Sn2.5Ag0.7Cu solder alloy ribbons were produced by single copper roller process with SP009A semi-automatic nonmetal series fabricate machine, and the micro-morphology and properties of intermetallic compound (IMC) were studied by JSM−5610LV scanning electronic microscope and energy spectrum analyzer. Through the analysis on the microstructure and shear fracture of the soldering joint, the influence mechanism of IMC on the toughness of soldering joint was studied. The results show that，in solder joint by using rapid solidification solder alloy, small size β-Sn tight arrangement at the interface can effectively inhibit the growth of IMC Cu6Sn5, and the IMC Cu6Sn5 and Ag3Sn in the supersaturated solid solution with small size and dispersive distribution massively precipitate as the second phase particle confounding with the primary phase during the solidification process to form fine eutectic structure in the soldering beam, and the toughness of soldering joint is improved.
Key words: Sn2.5Ag0.7Cu; solder; intermetallic compound (IMC); rapid solidification; soldering
