(1. 南昌大學(xué) 材料科學(xué)與工程學(xué)院，南昌 330031；
2. 九江學(xué)院 機械與材料工程學(xué)院，九江 332005；
3. 中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083)
摘 要: 利用TEM研究彌散Al2O3粒子對變形Cu-Al2O3彌散強化銅合金高溫退火顯微組織的影響。結(jié)果表明：彌散強化銅合金等時(1 h)退火時，顯微硬度HV呈緩慢下降趨勢，沒有發(fā)生突降現(xiàn)象；彌散銅高溫退火主要以位錯亞結(jié)構(gòu)回復(fù)為主，而亞晶較為少見；粒子彌散參數(shù)和胞壁性質(zhì)對退火時的回復(fù)產(chǎn)生非常重要的影響；Al2O3彌散粒子影響位錯在胞壁內(nèi)的運動，阻礙胞壁內(nèi)位錯重排、遷移，使得胞壁很難通過運動而獲得位向差的積累，從而阻礙大角晶界的形成；隨合金中彌散粒子含量的增大和粒子間距的減小，亞晶形核更加困難；Cu-Al2O3合金冷軋過程中形成的胞組織的胞壁具有較小的平均位向差，導(dǎo)致彌散銅合金高溫退火時難以形成具有明晰邊界的亞晶組織。
關(guān)鍵字: Al2O3彌散粒子；彌散強化銅；顯微組織；退火；回復(fù)
（1. School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China;
2. School of Mechanical and Materials Engineering, Jiujiang University, Jiujiang 332005，China;
3. School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The effect of Al2O3 disperoid on the dislocation structure of deformed and annealed Cu-Al2O3 alloys at elevated temperature was studied by TEM. The results show that the microhardness (HV) of the Cu-Al2O3 alloys decreases slowly with increasing annealing temperature under the condition of the same annealing time (1 h). The annealing microstructure features with a large amount of dislocation cells and few subgrains. The dispersion parameters and the nature of cell wall have a significant effect on the recovery of dislocation cells. The Al2O3 particle dispersion can interfere with the movement and rearrangement of dislocations in the cell walls. The prevention of long range motion of dislocations prohibits the accumulation of misorientation of the cell walls and then inhibits the formation of the high angle boundaries. The formation of subgrains becomes more difficult with the increase of the concentration of Al2O3 particle and decrease of the interparticle spacing. The cell walls formed in the as deformed alloys are of small average misorientation. As a result, the formation of well-defined subgrains is difficult during the annealing.
Key words: Al2O3 disperoid; dispersion strengthened copper; microstructure; annealing; recovering
