(中國科學(xué)院上海冶金研究所，上海 200050)
摘 要: 研究了電鍍Ni層和化學(xué)鍍Ni-P合金層對(duì)Sn-Ag/Cu焊點(diǎn)擴(kuò)散行為的影響，電子探針分析表明：化學(xué)鍍Ni-P合金層能很好地阻止Sn-Ag/Cu焊點(diǎn)在焊接過程中的Cu，Sn互擴(kuò)散和相互反應(yīng)；而電鍍Ni層則不能阻止Sn-Ag/Cu焊點(diǎn)在焊接過程中的Cu，Sn互擴(kuò)散和相互反應(yīng)，界面反應(yīng)產(chǎn)物仍以Cu6Sn5為主。應(yīng)用化學(xué)鍍Ni-P合金作為Sn-Ag/Cu之間的擴(kuò)散阻擋層可大大減少Sn/Cu金屬間化合物的生成，有利于提高焊點(diǎn)的可靠性。
關(guān)鍵字: 擴(kuò)散；電子器件封裝；鎳鍍層；金屬間化合物
（Shanghai Institute of Metallurgy, Chinese Academy of Sciences, Shanghai 200050, P.R.China）
Abstract:The effects of electroplated Ni layer and electroless plated Ni-P layer on the diffusion behavior in Sn-Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni-P layer acted as a good diffusion barrier between Sn-Ag solder and Cu substrate. However, the electroplated Ni layer can not hinder the inter-diffusion and reaction between molten Sn-Ag solder and Cu substrate when reflowing, and there was a layer of IMC (Cu6Sn5) at interface of Sn-Ag/C u solder joint. Electrolessly plated Ni-P layer can obviously decrease the generation of Sn-Cu IMC at the interface of Sn-Ag/Cu, which is beneficial to improve the reliability of solder joint.
Key words: diffusion; electronic packing; nickel-plated layer; intermetallic compounds
