(國(guó)防科技大學(xué) 機(jī)電工程與自動(dòng)化學(xué)院， 長(zhǎng)沙 410073)
摘 要: 基于能量最小原理對(duì)裝配后的EBGA焊點(diǎn)形態(tài)進(jìn)行了預(yù)測(cè)。 采用統(tǒng)一型粘塑性Anand本構(gòu)方程描述了Sn63Pb37合金的粘塑性力學(xué)行為， 采用非線性有限元方法研究了EBGA焊點(diǎn)在熱循環(huán)條件下的應(yīng)力應(yīng)變過(guò)程及其特殊性， 應(yīng)用基于能量和損傷累積的Darveaux方法預(yù)測(cè)了EBGA焊點(diǎn)的熱循環(huán)壽命。
關(guān)鍵字: 可靠性； 焊點(diǎn)； 形態(tài)預(yù)測(cè)； 熱疲勞壽命； 非線性有限元分析；粘塑性
of EBGA solder joint
（College of Mechatronic Engineering and Automation,
National University of Defense Technology, Changsha 410073, China）
Abstract:Based on the principle of the minimum energy, the energy control equation for solder joint geometry was presented and three-dimensional geometry of the solder joint mounted on the PCB was predicted by using Surface Evolver program. The unified viscoplastic Anand constitutive equation was employed to represent the viscoplastic deformation behavior of Sn63Pb37 alloy, nonlinear finite element method was applied to study the accumulation of inelastic strain and the feature of stress—strain distribution in the solder joints under thermal cycling. At last, the thermal cycle life of EBGA solder was predicted using the energy-based and damage-based Darveaux method.
Key words: reliability； solder joint； thermal fatigue life； nonlinear finite element analysis; viscoplasticity
