黃振鳳2, 麥漢輝2, 劉世胄2
(1. 哈爾濱工業(yè)大學(xué) 現(xiàn)代焊接生產(chǎn)技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室， 哈爾濱 150001;
2. 深圳寶安聯(lián)華實(shí)業(yè)有限公司， 深圳 518106)
摘 要: 研制了鋁硬釬焊用釬料膏， 對(duì)其工藝性能進(jìn)行了研究。 將釬料粉分離成不同的顆粒度配制成釬料膏進(jìn)行實(shí)驗(yàn)， 結(jié)果表明隨著釬料粉顆粒度的增加， 釬料膏的流動(dòng)性和填縫性能力增強(qiáng), 在保證釬料膏能填縫的前提下， 釬料粉的顆粒度越大， 所需釬劑的量越小， 可以降低釬料膏的成本。 用Al-Si共晶合金粉、 氟化物釬劑和粘結(jié)劑按適當(dāng)比例配制成膏狀, 確定了釬料膏各組分的最佳配比及其焊接工藝參數(shù)， 實(shí)驗(yàn)表明配制的釬料膏具有較好的焊接性能和焊縫成型性。
關(guān)鍵字: 釬焊； 硬釬料膏； 氟化物釬劑
HUANG Zhen-feng2, MAI Han-hui2, LIU Shi-zhou2
（1. State Key Laboratory of Advanced Welding Production Technology,
Harbin Institute of Technology, Harbin 150001, China;
2.Shenzhen Bao′an Lianhua Industry Co. Ltd, Shenzhen 518106, China）
Abstract:A solder paste used for brazing was developed and its technical performance was investigated. The experimental results show that the spread ability and the clearance fill ability of the solder paste increase with the increase of grain size of Al-Si metal powder. With the precondition of the nicer clearance fill ability of the solder paste, a small amount of flux and bigger grain size of Al-Si are in favor of the reduce of cost. The solder paste was executed with Al-Si eutectic metal power, nocolok brazing flux and organic fibrin binder according to some proportion. Brazing parameters and the optimal composition proportion of the solder paste were decided. The results show that the solder paste take on favorable brazing ability and nicer clearance fill ability.
Key words: brazing; solder paste; nocolok
