(1. 江蘇理工大學 材料系， 鎮(zhèn)江 212013;
2. 浙江大學 材料系， 杭州 310027)
摘 要: 用Ti/Cu/Ti多層中間層在1 273 K進行氮化硅陶瓷部分瞬間液相連接，實驗考察了保溫時間對連接強度的影響。用SEM EPMA和XRD對連接界面進行微觀分析，并用擴散路徑理論，研究了界面反應產(chǎn)物的形成過程。結果表明：在連接過程中，Cu與Ti相互擴散，形成Ti活度較高的液相，并與氮化硅發(fā)生反應，在界面形成Si3N4/TiN/Ti5Si3+Ti5Si4＋TiSi2/TiSi2＋Cu3Ti2(Si)/Cu的梯度層。保溫時間主要是通過影響接頭反應層厚度和殘余熱應力大小而影響接頭的連接強度。
關鍵字: 部分瞬間液相連接； 氮化硅； 擴散路徑；界面反應；連接強度
Si3N4 partial transient liquid-phase bonded with
Ti/Cu/Ti multi-interlayer
（1. Department of Materials Science，
Jiangsu University of Science and Technology， Zhenjiang 212013, P.R.China;
2. Department of Materials Science， Zhejiang University， Hangzhou 310027, P.R.China）
Abstract:The partial transient liquid phase(PTLP) bonding of silicon nitride was carried out at 1 273 K with Ti/Cu/Ti multi-interlayer. The effect of bonding time and interfacial reaction on the joint strength were investigated and the interfacial microstructures were observed and analyzed using SEM，EPMA and XRD respectively. The formation and transition processes of interface layer sequence at the interface were discussed by diffusion path. It is shown that Cu-Ti transient liquid alloy forms on the surface of silicon nitride and reacts with silicon nitride on the interface at 1 273 K，forming the Si3N4/TiN/Ti5Si3＋Ti5Si4＋TiSi2/TiSi2＋Cu3Ti2(Si)/Cu gradient interface. Owing to the variation of concentration in transient liquid，the diffusion path in the subsequent reaction changes. According to the microstructural analyses，the joint strength is affected by the thickness of reaction layer and the amount of residual thermal stresses which are affected by the bonding time.
Key words: partial transient liquid phase bonding; silicon nitride; interface reaction; diffusion path; bonding strength
