(中國科學(xué)院 上海冶金研究所， 上海 200050)
摘 要: 對(duì)電子封裝IGBT功率模塊進(jìn)行熱循環(huán)實(shí)驗(yàn)，考察了92.5Pb5Sn2.5Ag釬料焊層的熱循環(huán)失效和裂紋擴(kuò)展。應(yīng)用超聲波顯微鏡對(duì)裂紋擴(kuò)展過程進(jìn)行檢測，得到了熱循環(huán)失效的裂紋擴(kuò)展數(shù)據(jù)。采用統(tǒng)一型粘塑性Anand方程描述了92.5Pb5Sn2.5Ag的力學(xué)本構(gòu)，模擬了功率模塊釬料焊層裂紋體在熱循環(huán)條件下的應(yīng)力應(yīng)變。基于對(duì)ΔJ積分的求解，描述了PbSnAg焊層熱循環(huán)裂紋擴(kuò)展速率。
關(guān)鍵字: 92.5Pb5Sn2.5Ag釬料； 熱循環(huán)；裂紋擴(kuò)展； 粘塑性；ΔJ積分
（Shanghai Institute of Metallurgy， The Chinese Academy of Science，
Abstract:By applying thermal cycling tests to the IGBT power modules， the thermal fatigue and crack propagation of 92.5Pb5Sn2.5Agsolder layer were investigated. The crack propagation process in solder layer was inspected with Cmode scanning acoustic microscope (CSAM) and the crack propagation data were also measured. By employing the unified viscoplastic Anand constitutive equation to represents the deformation behavior of 92.5Pb5Sn2.5Ag solder，the stress/strain responses of the power modules with crack in PbSnAg solder layer under thermal cycling were simulated with finite element method. Moreover，the crack propagation rate of PbSnAg solder layer under thermal cycling was described based on the calculationof mechanical parameter ΔJ integral.
Key words: 92.5Pb5Sn2.5Ag solder; thermal cycling; crack propagation; viscoplastic; ΔJ integral
