再結(jié)晶和晶粒長大
(北京科技大學(xué) 材料學(xué)系， 北京 100083)
摘 要: 采用EBSD微取向分析、織構(gòu)定量分析、晶粒尺寸分析等手段研究了低壓電子鋁箔不同退火加熱過程對再結(jié)晶和晶粒長大行為的影響，并利用再結(jié)晶理論對相關(guān)過程進(jìn)行了討論。初次再結(jié)晶前的回復(fù)處理會明顯降低冷軋鋁箔的儲存能及再結(jié)晶驅(qū)動力，并對再結(jié)晶晶粒尺寸和立方織構(gòu)量產(chǎn)生規(guī)律性影響。特定的退火加熱過程會誘發(fā)電子鋁箔的晶粒異常長大，并導(dǎo)致立方織構(gòu)量的明顯下降。
關(guān)鍵字: 電子鋁箔；退火；再結(jié)晶；晶粒長大；立方織構(gòu)
resistance of laser clad Ni-Si silicides
composite coating
（Laboratory of Laser Materials Processing and Surface Engineering,
School of Materials, Beijing University of Aeronautics and
Astronautics, Beijing 100083, China）
Abstract:The influence of different annealing processes on the recrystallization and grain growth behaviors of low voltage electron aluminum foil was investigated using the quantitative texture analysis，EBSD micro-orientation analysis，as well as grain size measurement. The corresponding processes were also discussed based on the current recrystallization theory. A recovery process before primary recrystallization will reduce the storage energy as well as the recrystallization driving force drastically，and therefore influence the recrystallization grain size and volume fraction of cube texture systematically. An abnormal grain growth process，connected with strong cube texture in electron aluminum foil，could be induced by certain special annealing treatment，which will decrease the volume fraction of cube texture obviously.
Key words: electron aluminum foil；annealing； recrystallization；grain growth；cube texture
