(西安交通大學(xué) 材料科學(xué)與工程學(xué)院，
金屬材料強(qiáng)度國(guó)家重點(diǎn)實(shí)驗(yàn)室，西安 710049)
摘 要: 采用真空感應(yīng)熔煉法獲得不同Ni含量的CuCr25合金。通過(guò)觀察其顯微組織和測(cè)量其性能得如下結(jié)果：隨Ni含量的增加，合金的Cr相由樹(shù)枝晶轉(zhuǎn)變?yōu)楣?jié)點(diǎn)狀晶粒，并且得到明顯細(xì)化；合金的電導(dǎo)率大幅度下降，但是Ni含量小于0.5%，電導(dǎo)率大于20MS/m，相當(dāng)常規(guī)CuCr50的性能；Ni含量對(duì)該合金的耐電壓強(qiáng)度影響不大。
關(guān)鍵字: CuCr25合金；顯微組織；電導(dǎo)率；耐電壓強(qiáng)度
and properties of CuCr25 contact materials
（State Key Laboratory for Mechanical Behavior of Metal Materials，
School of Materials Science and Technology,Xi′an Jiaotong University, Xi′an 710049, China）
Abstract:CuCr25 alloys containing different Ni content were prepared by vacuum induction melting (VIM). The microstructure and properties were tested. The results shows that with the increase of Ni content in CuCr25 alloys, the Cr phase transformed from developed dendrite into nodular grains and was refined drastically; the electrical conductivity decrease significantly, but still reach the level of conventional CuCr50, when the Ni content is below 0.5%; the Ni content has little influence on their breakdown strength.
Key words: CuCr25 alloys; microstructure; electrical conductivity; breakdown strength
