(1. 大連理工大學(xué) 化工學(xué)院， 大連 116012；
2. 沈陽工業(yè)大學(xué) 理學(xué)院， 沈陽 110023)
摘 要: 研究了一種新型可焊性鍍層 含銀量3%的錫銀合金的電鍍工藝，選擇甲基磺酸亞錫和甲基磺酸銀為主鹽，檸檬酸鈉、碘化鉀和三乙醇胺為絡(luò)合劑，研制了鍍覆含銀量為3％的最佳鍍液配方和施鍍工藝條件。 通過對鍍層可焊性、抗高溫氧化性能和表面接觸電阻等性能的考察發(fā)現(xiàn)，低含銀量的錫銀合金鍍層性能優(yōu)于錫鉛合金鍍層，且鍍液成分簡單、性能穩(wěn)定、無毒無害，具有廣泛的應(yīng)用前景。
關(guān)鍵字: 電鍍； Sn-Ag合金； 可焊性鍍層
solderable coatings from methanesulfonate bath
（1. School of Chemical Engineering, Dalian University of Technology,
Dalian 116012, P.R.China；
2. School of Science, Shenyang University of Technology,
Shenyang 110023, P.R.China）
Abstract:A new solderable coating-SnAg (3%Ag) alloy is recommended as a substitute for SnPb alloy coating. The processes of electroplating SnAg (3%Ag) alloy from methanesulfonate bath were studied. The sorts of main salts, complexing agents and additives were determined. The bath functions such as stability, covering power, throwing power, current efficiency, deposition velocity and cathodic polarization curves were tested. The surface appearances were observed.
Key words: electroplating; SnAg alloy; solderable coating
