(東華大學(xué) 環(huán)境科學(xué)與工程學(xué)院，上海 201620)
摘 要: 研究電解法從廢棄印刷線路板的碘化浸金液中沉積金。結(jié)果表明，電解法從廢棄印刷線路板的碘化浸金液中沉積金的最佳工藝條件為：碳棒作陰極，鈦板作陽極，陰離子交換膜隔開電解槽，陽極碘液中碘的質(zhì)量分?jǐn)?shù)為0.1%~0.8%，n(I2)׃n(I−)=1׃10，槽電壓為10~14 V，陰極碘化浸金液中金的濃度為15~50 mg/L，電解時(shí)間為1~4 h，金的電解沉積率大于95%。電解實(shí)驗(yàn)后，陽極碘液可以重復(fù)作為電解質(zhì)使用或再次用來從廢棄印刷線路板中浸取金。
關(guān)鍵字: 電沉積；廢棄印刷線路板；碘化法；金
waste printed circuit board
（School of Environmental Science and Engineering, Donghua University, Shanghai 201620, China）
Abstract:The technical process of electrodepositing gold of iodine leaching solution from waste printed circuit board (PCB) was investigated. The results show that the most optimized conditions of electrodepositing gold of iodine leaching solution from waste PCB are elicited that the cell carbon rods(cathode) and titanium plate (anode) are used as electrode, the cell is partitioned by anion exchange membrane, the iodine concentration in anode solution is 0.1%−0.8%, n(I2)׃n(I−)=1׃10, the cell voltage is 10−14 V, the gold concentration in cathode solution is 15−50 mg/L, the electrolyzing time is 1−4 h, the electrodepositing rate of gold is more than 95%. After electrolytic experiment, the anode iodine solution can be recycled for electrolyte or leaching gold from waste PCB.
Key words: electrodeposit; waste printed circuit board; iodine process; gold
