郁偉嘉， 王雪艷， 程樹(shù)東， 孫 玲，
費(fèi)瑞霞， 王峻峰，
(東南大學(xué) 無(wú)線電工程系 射頻與光電集成電路研究所,
南京 210096)
摘 要: 介紹了2.5～40Gb/s的光通信收發(fā)器處理芯片的研究情況，芯片功能包括復(fù)接器、 激光驅(qū)動(dòng)器、 前置放大器與限幅放大器、 時(shí)鐘恢復(fù)和數(shù)據(jù)判決電路以及分接器。 采用的工藝有0.18/0.25μmCMOS, 0.15/0.2μmGaAs PHEMT和2μmGaAsHBT等， 采用多項(xiàng)目晶圓方式和國(guó)外先進(jìn)的工藝生產(chǎn)線進(jìn)行芯片制作。研究中采用了高速電路技術(shù)和微波集成電路技術(shù)， 如采用SCFL電路、超動(dòng)態(tài)D觸發(fā)器電路、同步注入式VCO、分布放大器、 共面波導(dǎo)和傳輸線技術(shù)等。 在SDH 155Mb/s~2.5Gb/s的收發(fā)器套片設(shè)計(jì)方面已實(shí)現(xiàn)產(chǎn)品化。 還介紹了10Gb/s的收發(fā)器套片產(chǎn)品化問(wèn)題， 如封裝問(wèn)題等， 討論了40Gb/s以上速率芯片技術(shù)的發(fā)展趨勢(shì)，包括高速器件建模和測(cè)試問(wèn)題等。
關(guān)鍵字: 光纖通信； SDH； 超高速集成電路； 收發(fā)器； CMOS； GaAs; PHEMT; HBT; SCFL; VCO
WANG Huan, CHEN Hai-tao, MENG Fan-sheng,
YANG Shou-jun, WU Chun-hong, QIU Ying-hua,
SHEN Zhen, YU Wei-jia, WANG Xue-yan,
（Department of Radio Engineering,
Southeast University, Nanjing 210096, China）
Abstract:The transceiver integrated circuits tehcnology of 2.5-40Gb/s was studied for optical-fiber communication. The ICs include multiplexer, laser-driver, preamplifier and limiting amplifier, clock recovery and data decision, demultiplexer. The technologies of 0.18/0.25μm CMOS, 0.15/0.2μm GaAs PHEMT and 2μm GaAs HBT were used to research and design the ICs. The MPW(multi-projet wafer) method and advanced foundry technology were adopted to produce the ICs. The high-speed circuit technology and MMIC technology were adopted to research our circuit, such as SCFL structure, super-dynamic DFF, synchronization injection VCO, distributed amplifier, coplanar waveguide and transmission-line technology. The 155Mb/s-2.5Gb/s SDH transceiver ICs was produced. The developing trand of above 40Gb/s ICs design technology was discussed, including high-speed device modeling and the ICs testing.
Key words: optical-fiber; communication; SDH; super-high speed integrated circuit; transceiver; CMOS; GaAs; PHEMT; HBT; SCFL; VCO
