(哈爾濱工業(yè)大學(xué) 材料科學(xué)與工程學(xué)院， 哈爾濱 150001)
摘 要: 采用專(zhuān)利擠壓鑄造方法制備了3種Mo體積分?jǐn)?shù)分別為55%、 60%和67%的Mo/Cu復(fù)合材料， 并對(duì)其微觀組織和導(dǎo)熱性能進(jìn)行了研究。 結(jié)果表明： Mo顆粒分布均勻， Mo/Cu界面干凈， 不存在任何界面反應(yīng)物和非晶層； 復(fù)合材料組織均勻、 致密， 且致密度高達(dá)99%以上； 復(fù)合材料的熱導(dǎo)率為220~270 W/(m·K)， 并隨著Mo含量的增加而降低。 混合定律(ROM)較好地預(yù)測(cè)了55%Mo/Cu復(fù)合材料的熱導(dǎo)率， 而采用Maxwell模型和H-M模型的計(jì)算值與60%和67%Mo/Cu復(fù)合材料的熱導(dǎo)率測(cè)試值一致。
關(guān)鍵字: Mo/Cu復(fù)合材料； 致密度； 熱導(dǎo)率
（ School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China）
Abstract: Mo/Cu composites with Mo volume fractions of 55%, 60% and 67% were fabricated by the patented squeeze-casting technology, and the microstructures and thermal conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo/Cu interfaces are clean and free from interfacial reaction products or amorphous layers. The relative density of the Mo/Cu composites is higher than 99%. The thermal conductivity of Mo/Cu composites is 220-270 W/(m·K), which can meet the demands of high thermal conductivity for electronic package. The thermal conductivities of Mo/Cu composites decrease with the increase of Mo volume fraction. The ROM model can well predicate the thermal conductivities of 55%Mo/Cu composites, while the values calculated by Maxwell model and H-M Model agree well with the thermal conductivities of 60% and 67%Mo/Cu composites.
Key words: Mo/Cu composites; density; thermal conductivity
