( 1. 電子科技大學(xué) 微電子與固體電子學(xué)院，成都 610054;
2. 西安交通大學(xué) 金屬材料強(qiáng)度國(guó)家重點(diǎn)實(shí)驗(yàn)室， 西安 710049)
摘 要: 采用原子力顯微鏡和X射線(xiàn)衍射儀研究了Al2O3基體上磁控濺射Au/NiCr/Ta多層金屬膜基礎(chǔ)上化學(xué)鍍Au膜的生長(zhǎng)形貌、 晶體取向和殘余應(yīng)力， 并與磁控濺射Au膜進(jìn)行了對(duì)比。 結(jié)果表明： 通過(guò)化學(xué)鍍工藝生長(zhǎng)的Au膜延續(xù)了磁控濺射薄膜柱狀晶結(jié)構(gòu)生長(zhǎng)的特點(diǎn)， 但薄膜生長(zhǎng)顆粒出現(xiàn)聚合現(xiàn)象， 磁控濺射Au膜的顆粒尺寸約為60 nm， 化學(xué)鍍Au膜尺寸可增加到400 nm左右； 化學(xué)鍍薄膜在磁控濺射薄膜基礎(chǔ)上表面粗糙度增大， 化學(xué)鍍工藝對(duì)磁控濺射金屬薄膜的晶體取向具有承繼性， 并伴隨有晶體取向擇優(yōu)生長(zhǎng)的“放大”作用， 但對(duì)殘余應(yīng)力則有一定的調(diào)節(jié)作用。
關(guān)鍵字: 磁控濺射； 化學(xué)鍍； 金屬薄膜
（ 1. School of Microelectronic and Solid State Electronics, University of Electronic Science and Technology of China, Chengdu 610054, China;
2. State Key Laboratory for Mechanical Behavior of Materials,
Xi'an Jiaotong University, Xi'an 710049, China）
Abstract: Au/NiCr/Ta multi-layered metal films were deposited on Al2O3 substrate by magnetron sputtering and then Au film was chemically plated. The crystal orientation, residual stress and surface morphology were investigated, and comparison was made between plating and magnetron sputtering technology by X-ray diffractrometry and atomic force microscopy. Au grain increases from 60 to 400 nm after plating. The results indicate that the plating technology can inherit the crystal orientation from magnetron sputtering, enlarge the preferred orientation, and harmonize the residual stress. The surface roughness of Au films increases after plating.
Key words: magnetron sputtering; chemical plating; metallic films
