Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學(xué)報(bào)

ZHONGGUO YOUSEJINSHU XUEBAO

第15卷    第11期    總第80期    2005年11月

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文章編號(hào): 1004-0609(2005)11-1780-06
磺基水楊酸對(duì)鎳硫合金涂層結(jié)構(gòu)及電化學(xué)性能的影響
何捍衛(wèi), 劉紅江, 周科朝

(中南大學(xué) 粉末冶金國家重點(diǎn)實(shí)驗(yàn)室, 長沙 410083)

摘 要:  以硫脲為硫源、 磺基水楊酸為改性劑, 采用改進(jìn)的Watt浴體系電沉積制備鎳-硫合金涂層電極, 用SEM觀察涂層表面形貌, XRD分析涂層結(jié)構(gòu)與相組成, 電化學(xué)測試方法分析涂層的電化學(xué)行為。 結(jié)果表明, 磺基水楊酸在電沉積過程中既促進(jìn)了晶核的形成, 又阻礙了晶粒的長大, 導(dǎo)致Ni-S沉積層的晶粒細(xì)化、 非晶態(tài)化程度和硫含量的提高。 所制備的Ni-S合金涂層具有較好的附著力, 用于堿性水電解時(shí)有較高的析氫活性。 當(dāng)鍍液中磺基水楊酸濃度為5 g/L時(shí), Ni-S合金鍍層附著力增大至19 MPa, 析氫過電位降低約13 mV。

 

關(guān)鍵字:  磺基水楊酸; Ni-S沉積層; 電化學(xué)活性; 附著力

Effect of sulphosalicylic acid on structures and electrochemical properties of nickel sulphur alloy coatings
HE Han-wei, LIU Hong-jiang, ZHOU Ke-chao

State Key Laboratory of Powder Metallurgy, Central South University,
 Changsha 410083, China

Abstract: Nickel-sulphur alloy coating electrodes were prepared on the nickel substrates by electrodeposition method in a modified Watts using thiourea (TU) and sulphosalicylic acid as sulphur source and modifier, respectively. Adsorption effect of sulphosalicylic acid on the electrochemical activities, grain sizes, textures and sulphur contents of Ni-S deposits were studied by means of electrochemical methods, SEM and X-ray diffraction. The results show that the sulphosalicylic acid accelerates the nucleation processes and hinders grain growth. The Ni-S deposits obtained from bath containing sulphosalicylic have higher sulphur contents, obvious amorphous textures and much smaller grain sizes than those from the bath without additive. Ni-S alloys as a cathode materials of alkaline water electrolysis have higher hydrogen evolution activities and better adhesion. The adhesion increases with the increase of sulphosalicylic acid concentration, and reaches 19 MPa at 5 g/L sulphosalicyclic acid. At the same time, the hydrogen evolution overpotential is the lowest at 5 g/L sulphosalicylic acid, which is 13 mV lower than that of the bath without additive.

 

Key words: sulphosalicylic acid; Ni-S deposits; electrochemical activity; adhesion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學(xué)技術(shù)協(xié)會(huì) 主辦:中國有色金屬學(xué)會(huì) 承辦:中南大學(xué)
湘ICP備09001153號(hào) 版權(quán)所有:《中國有色金屬學(xué)報(bào)》編輯部
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