(浙江大學(xué) 金屬材料研究所， 杭州 310027)
摘 要: 化學(xué)鍍是制備納米顆粒增強(qiáng)金屬基復(fù)合材料的有效方法。對納米Al2O3p化學(xué)鍍銅粉末的燒結(jié)致密化特點進(jìn)行了研究，分析了化學(xué)鍍粉末的預(yù)處理、 成型壓力、 燒結(jié)溫度、 保溫時間、 復(fù)壓復(fù)燒工藝等對致密化的影響。 在優(yōu)化各影響因素的情況下， 對Al2O3含量為10%的化學(xué)鍍銅粉末采用常規(guī)粉末冶金工藝得到了相對致密度達(dá)94%的試樣。
關(guān)鍵字: 銅基復(fù)合材料； 納米氧化鋁； 粉末冶金； 致密化； 化學(xué)鍍
electroless copper plating
（Institute of Metallic Materials, Zhejiang University, Hangzhou 310027, China）
Abstract: Electroless plating is an effective method to prepare various metal/ceramic compounds， which can get a high mixing homogeneity and improved metal/ceramic interface bond in metal matrix composites(MMCs) reinforced by ceramic. The characteristics of sintering densification of Cu/Al2O3p composites were investigated. The influences of powder preparation, pressing pressure, sintering temperature, soaking time and repressing-resintering on the densification were studied. On the basis of optimizing parameters， the relative density of Cu/nano-Al2O3p with norminal content of 10% Al2O3(mass fraction) can reach 94% via conventional powder metallurgy.
Key words: copper matrix composites； nano-Al2O3； powder metallurgy； densification； electroless plating
