( 1. 北京科技大學(xué) 物理化學(xué)系， 北京 100083;
2. 昆明理工大學(xué) 材料冶金工程學(xué)院， 昆明 650093)
摘 要: 闡述了無(wú)鉛釬料合金設(shè)計(jì)的原則， 討論了合金相圖及其計(jì)算在無(wú)鉛錫基釬料合金設(shè)計(jì)中的作用。 利用相圖計(jì)算技術(shù)篩選了可能代替Pb-Sn共晶釬料合金的Sn-Zn-In三元(x(Zn)＜0.11， x(In)=0.10~0.14)和Sn-Zn-In-Ag四元(x(Sn)=0.800， x(In)=0.090， x(Zn)=0.075， x(Ag)＜0.049)無(wú)鉛錫基釬料合金。 初步討論了用相圖計(jì)算技術(shù)在富Sn四元Sn-Zn-In-Ag無(wú)鉛釬料合金基礎(chǔ)上， 添加Bi， Sb等低熔點(diǎn)金屬和微量Ce， La等稀土元素以降低貴金屬In和Ag的含量， 進(jìn)一步提高無(wú)鉛錫基多元合金釬料的綜合性能和性能價(jià)格比。
關(guān)鍵字: 釬料合金; 無(wú)鉛釬料; 相圖; 相圖計(jì)算
SUN Yong2, QI Geng-xin2
（ 1. Department of Physical Chemistry, University of Science and Technology Beijing,Beijing 100083, China;
2. School of Materials and Metallurgical Engineering,
Kunming University of Science and Technology,
Kunming 650093, China）
Abstract: The principles for lead-free solder alloy design and the importance of phase diagram study as well as the calculation of phase diagram(CALPHAD) approach in the lead-free solder alloy design are discussed. Based on CALPHAD approach two potential lead-free solder alloys, i.e., the Sn-Zn-In（x(Zn)＜0.11, x(In)=0.10-0.14）ternary alloy and the Sn-Zn-In-Ag（x(Sn)=0.800, x(In)=0.090, x(Zn)=0.075, x(Ag)＜0.035）quaternary alloy are recommended as lead-free solder alloy instead of the Pb-Sn eutectic solder alloy. The further work for decreasing the content of In and Ag in Sn based Pb-free multi-component alloy with excerlent properties is brief discussed.
Key words: solder alloy; Pb-free solder; phase diagram; CALPHAD
