組織的影響
( 山東大學(xué) 材料液態(tài)結(jié)構(gòu)及其遺傳性教育部重點實驗室， 濟南 250061)
摘 要: 采用NETZSCH DSC 404型差示掃描量熱儀（DSC）、 掃描電子顯微鏡（SEM）等手段研究了添加元素Sb， Bi和Fe對Cu-8P共晶合金熔點和組織的影響。 實驗結(jié)果表明： Sb， Bi和Fe均能降低Cu-8P合金的熔點。 一定量的Sb與Cu， P形成低熔點相， 從而大幅降低了Cu-8P合金的熔點， 使其熔點降低近200℃；加入少量Bi后， Bi與Cu在共晶團晶界上形成熔點為270℃左右的低熔點化合物，且Bi的加入明顯細化Cu-8P合金共晶團， 從而使Cu-8P合金的熔點降低； 加入Fe能明顯細化Cu-8P合金的共晶團， 使層片間距由8μm減為2μm以下，并使共晶團由層片狀向短棒狀轉(zhuǎn)變， 雖然Fe與Cu形成熔點為806℃的高溫相，但Fe的細化作用使得Cu-8P合金的熔點降低， 但降低幅度不大。 同時得出形成低熔點的化合物（相）和細化晶粒是降低合金熔點的有效途徑。
關(guān)鍵字: Cu-P基合金；熔點； 組織
microstructures of eutectic Cu-8P alloys
LIU Xiang-jun， BIAN Xiu-fang
（ The Key Laboratory of Ministry of Education for Liquid Structure and Heredity of Materials,
College of Materials Science and Engineering, Shandong University, Ji′nan 250061, China）
Abstract: The effect of Sb, Bi and Fe on the melting points and microstructures of Cu-8P alloys were studied by means of DSC and SEM. It is found that the addition of Sb, Bi and Fe can decrease the melting points of Cu-8P eutectic alloy. Sb can combine with Cu and P to form a low melting point compound which lowers the melting point of binary Cu-8P eutectic alloy by nearly 200℃. Bi and Cu can create compounds with low melting point(270℃) distributing at the boundaries and that is the reason why the melting point of (Cu-8P)-Bi is lower than that of binary Cu-8P eutectic alloy. The eutectic cluster can be refined with the addition of Fe, and that is the reason why the addition of Fe can decrease the melting point of Cu-8P alloy. Two means of decreasing the melting point of Cu-8P are found. One is to form compound with low melting point, the other is to refine the eutectic cluster.
Key words: Cu-8P base alloy; melting point; microstructure
