(江蘇工業(yè)學(xué)院 材料系， 常州 213016)
摘 要: 通過均相沉淀法制備了納米CeO2和Al2O3粉體， 研究了在相同拋光條件下納米CeO2、 Al2O3和SiO2磨料對硅片的拋光效果， 用原子力顯微鏡觀察了拋光表面的微觀形貌并測量其表面粗糙度。 結(jié)果表明： 納米CeO2磨料拋光后表面具有更低的表面粗糙度， 在5 μm×5 μm范圍內(nèi)表面粗糙度Ra值為0.240 nm， 而且表面的微觀起伏更趨向于平緩； 考慮了納米磨料在拋光條件下所發(fā)生的自身變形， 其變形量相當(dāng)于一部分抵消了納米磨料嵌入基體材料的切削深度， 而這個(gè)切削深度最終決定了拋光表面的粗糙度； 分析指出這個(gè)變形量與納米磨料的硬度成反比， 硬度低的納米磨料由于自身變形量大， 導(dǎo)致切削深度小， 拋光后表面的粗糙度值低。 解釋了在相同的拋光條件下不同硬度的納米磨料具有不同的拋光表面粗糙度的原因。
關(guān)鍵字: 納米磨料； 硬度； 粗糙度； 超光滑表面； 拋光
（ Department of Materials and Engineering,
Jiangsu Polytechnic University,Changzhou 213016, China）
Abstract: Nano-powder of CeO2 and Al2O3 were prepared via homogenous precipitation, and the different polishing behavior of nano-CeO2, nano-Al2O3 and nano-SiO2 abrasives under the same polishing condition were studied by atomic force microscopy (AFM). The surface roughness of the wafer polished by nano-CeO2 is lower than that polished by the nano-Al2O3 and nano-SiO2, and its surface undulation is smaller. The influence of the deformation of the abrasive particle on polishing mechanism is considered for the first time. The deformation of the abrasive counteracts part of the cutting depth which determines the roughness of the polished surface. The deformation amount is in proportion to the hardness of the abrasives. The reason why the abrasives with different hardness has different polishing behavior is analyzed.
Key words: nano-sized abrasives; hardness; roughness; super-smooth surface; polishing
