(中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083)
摘 要: 通過對快速凝固高硅鋁合金粉末(Al-30%Si)進行真空包套熱擠壓， 制備出高硅鋁合金電子封裝材料， 研究了粉末粒度對高硅鋁合金材料組織及性能的影響。 利用金相顯微鏡、 掃描電鏡、 萬能電子拉伸機、 差熱分析儀、 TR-2熱物性測試儀等設(shè)備系統(tǒng)測試和分析了該材料的顯微組織、 力學(xué)和物理性能。 結(jié)果表明： 原始粉末顆粒尺寸大小能顯著影響材料熱擠壓后的顯微組織和性能。 原始粉末顆粒越細小， 其硅相越細小、 抗拉強度和致密度越高、 氣密性越好、 熱導(dǎo)率和熱膨脹系數(shù)越低。
關(guān)鍵字: 高硅鋁合金; 電子封裝材料; 快速凝固; 熱擠壓; 熱膨脹系數(shù); 熱導(dǎo)率
（ School of Materials Science and Engineering, Central South University,
Changsha 410083, China）
Abstract: Two kinds of high silicon aluminum alloys, applied in lightweight electronic packaging material in the aviation and space fields, were prepared with the rapidly solidified high-silicon aluminum alloy(Al-30%Si) powder by vacuum canning and hot-extrusion processes. The effect of particle size on the microstructure and properties of high-silicon aluminum alloys was studied by optical microscopy, scanning electron microscopy, universal material testing machine, thermal analyzer and TR-2 thermal physics test. The experimental results show that, the original particle size can greatly affect the microstructure and properties of the alloy. If the original particles are small, the final silicon crystal size will be small, the tensile strength is high, the relative density is high and the hermeticity is good, the thermal conductivity and the coefficients of thermal expansion of the alloy are low.
Key words: high silicon aluminum alloy; electronic packaging material; rapid solidification; hot extrusion; thermal expansion coefficient; thermal conductivity
