(1. 中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083；
2. 南京電子器件研究所， 南京 210016)
摘 要: 根據(jù)Ag-Cu-Ge系三元相圖， 制備了Ag-Cu33.4-Ge28.1， Ag-Cu43-Ge20 (質(zhì)量分?jǐn)?shù)， %)兩種中溫合金釬料。 利用金相顯微鏡、 DTA對釬料組織及其熔點(diǎn)進(jìn)行分析，并對其潤濕性進(jìn)行測試。 結(jié)果表明： 兩種合金釬料的熔化溫區(qū)為539~622 ℃， Ag-Cu33.4-Ge28.1合金對于純Ni和Cu具有良好的漫流性和潤濕性。 利用掃描電鏡和能譜儀對釬焊后的界面微觀組織進(jìn)行觀察與分析， 發(fā)現(xiàn)在界面處形成了固溶體和金屬間化合物。
關(guān)鍵字: Ag-Cu-Ge； 釬料； 潤濕性； 界面
new type Ag-Cu-Ge solder
LI Shi-chen1, YE Jian-jun2
（1. School of Materials Science and Engineering,
Central South University, Changsha 410083, China;
2. Nanjing Electronic Devices Institute, Nanjing 210016, China）
Abstract: According to Ag-Cu-Ge phase diagram, two solders Ag-Cu33.4-Ge28.1 and Ag-Cu43-Ge20 (mass fraction, %) were designed. The microstructure and melting point of two solders were studied by optical microscope and differential thermal analysis(DTA), and the wettability of solders with base metal was tested. The results show that, the melting temperatures of the two solders are in the range of 539-622 ℃, Ag-Cu33.4-Ge28.1 solder has good flowability and wettability to Ni and Cu substrates. The scanning electron microscope equipped with energy dispersive X-ray (EDX) analysis system was used to inspect and analyze the interfacial microstructure, and the solid solution and intermetallic compounds were found in interface.
Key words: Ag-Cu-Ge; solder; wettability; interface
