化合物的生長行為
(北京科技大學(xué) 材料科學(xué)與工程學(xué)院，北京 100083)
摘 要: 對熱-剪切循環(huán)條件下Sn-3.5Ag-0.5Cu/Cu和Sn-Pb/Cu界面上原子擴(kuò)散和化合物的生長行為進(jìn)行了研究。 結(jié)果表明： 再流焊后， 在兩界面上均形成一種Cu6Sn5化合物； 隨著熱剪切循環(huán)周數(shù)的增加， 兩界面上化合物的形態(tài)均從扇貝狀向?qū)訝钌L，其厚度隨循環(huán)周數(shù)的增加而增加， 且生長基本遵循拋物線規(guī)律， 說明Cu原子的擴(kuò)散控制了Cu6Sn5化合物的生長。 界面近域的釬料內(nèi)， 顆粒狀的Ag3Sn聚集長大成塊狀。
關(guān)鍵字: Sn-3.5Ag-0.5Cu釬料； Sn-Pb釬料； 熱剪切循環(huán)； 金屬間化合物
Sn-3.5Ag-0.5Cu/Cu and Sn-Pb/Cu
interfaces during thermal-shearing cycling
ZHANG Hua, ZHAO Xing-ke
（School of Materials Science and Engineering,
University of Science and Technology Beijing, Beijing 100083, China）
Abstract: The atoms diffusion and growth behavior of intermetallic compounds (IMCs) at Sn-Ag-Cu/Cu and Sn-Pb/Cu interfaces under the thermal-shearing cycling condition were investigated. The results show that Cu6Sn5 forms at the two interfaces, and its thickness increases with the thermal-shearing cycling. The morphology of Cu6Sn5 varies from scallop-type to planar-type with increasing thermal-shearing cycling periods. The IMC growth follows growth kinetics of parabola, implying that IMC growth is controlled by Cu atom diffusion. In the solder, branch-like Ag3Sn forms after reflowing, congregates to grow up to planar after thermal-shearing cycling.
Key words: Sn-3.5Ag-0.5Cu solder; Sn-Pb solder; thermal-shearing cycling; intermetallic compound(IMC)
