Cu、 Ni基板釬焊界面IMC的影響
( 1. 大連理工大學(xué) 材料科學(xué)與工程學(xué)院， 大連 116023;
2. 香港城市大學(xué) 物理與材料科學(xué)系， 香港)
摘 要: 研究了不同銅含量的Sn-xCu釬料(x=0, 0.1%, 0.3%, 0.7%, 0.9%, 1.5%)與Cu板和Ni板在260、 280和290 ℃釬焊后界面金屬間化合物(IMC)的成分和形貌。 研究結(jié)果表明： 釬料與Cu板釬焊時(shí), 釬焊溫度越高, 界面處形成的Cu6Sn5 IMC厚度越大, 而在同一釬焊溫度下, 隨著釬料中銅含量的增加， IMC的厚度先減少后增加； 與Ni板釬焊時(shí), 界面IMC的厚度隨著銅含量的增加而增加, 同時(shí)界面化合物的成分和形貌均發(fā)生了顯著變化； 當(dāng)Cu含量小于0.3%(質(zhì)量分?jǐn)?shù))時(shí), 界面處形成了連續(xù)的(CuxNi1-x)3Sn4層; 而當(dāng)Cu含量為0.7%時(shí), 界面處同時(shí)存在著短棒狀(CuxNi1-x)3Sn4和大塊狀(CuxNi1-x)6Sn5 IMC; 當(dāng)銅含量繼續(xù)增大時(shí)(0.9%~1.5%),(CuxNi1-x)3Sn4 IMC消失, 只發(fā)現(xiàn)了棒狀(CuxNi1-x)6Sn5 IMC。 討論了釬料中Cu含量對(duì)與Cu、 Ni基板釬焊接頭界面化合物生長(zhǎng)的影響, 并進(jìn)一步討論了(CuxNi1-x)6Sn5 IMC的形成和長(zhǎng)大機(jī)理。
關(guān)鍵字: Sn-Cu釬料; 金屬間化合物(IMC); 釬焊; 界面反應(yīng)
（ 1. School of Materials Science and Engineering,
Dalian University of Technology, Dalian 116023, China;
2. Department of Physics and Materials Science,
City University of Hong Kong, Hong Kong, China）
Abstract: The reactions between Sn-xCu(x=0, 0.1%, 0.3%, 0.7%, 0.9%, 1.5%) and Cu or Ni at 260, 280 and 290 ℃ were studied to reveal the effect of varying Cu content on the composition and morphologies of intermetallic compounds (IMC) formed at the interface between solders and the substrate. The IMCs formed at the interface of Sn-Cu/Cu are Cu6Sn5. The higher the temperature is, the thicker the IMC layer forms. While soldering at the same temperature, with the increase of Cu content the thickness of IMC reduces first then increases. The thickness of IMC increases with the increase of Cu content when soldered with Ni at 260 ℃. And at the same time, the composition and morphologies of the IMC have notable changes. When the Cu content is below 0.3%(mass fraction), a continuous (CuxNi1-x)3Sn4 IMC layer formed at the interface. When the Cu content is 0.7%, bigger facet (CuxNi1-x)6Sn5 IMCs are found on the (CuxNi1-x)3Sn4 IMC layer. At higher Cu content (0.9%-1.5%), stick shaped (CuxNi1-x)6Sn5 IMCs are detected and (CuxNi1-x)3Sn4 IMCs disappear. The effect of Cu content on the growth of IMC layer is analyzed and the formation and growth mechanisms of (CuxNi1-x)6Sn5 IMC are discussed further.
Key words: Sn-Cu solder; intermetallic compound (IMC); soldering; interfacial reaction
