(中南大學 材料科學與工程學院，長沙 410083)
摘 要: 采用解析法研究了W/Cu 梯度功能材料板的殘余熱應力和在穩(wěn)態(tài)梯度溫度場下的工作熱應力的大小和分布狀況。結果表明： 隨著成分分布指數(shù)的增加， 殘余熱應力與工作熱應力的最大值先減小后增大， 當成分分布指數(shù)(P)取1時， 達到最小值； 隨著梯度層數(shù)的增加， 熱工作熱應力的最大值逐漸減小， 但當梯度層數(shù)達到6時， 隨著梯度層數(shù)的增加， 緩和效果并不明顯； 當梯度層厚度增加到5 mm時， 工作熱應力的最大值約為非梯度材料工作熱應力最大值的50%。
關鍵字: W/Cu梯度功能材料； 溫度場； 熱應力
W/Cu functionally graded material
（ School of Materials Science and Engineering,
Central South University, Changsha 410083, China）
Abstract: The residual thermal stress and the steady working thermal stress in the plate of W/Cu functionally graded material were analyzed by the analytical solution. The numerical results show that the compositional exponent (P), the number of layers(n) and the thickness of graded layer(hFGM) have significant effects on the thermal stress. The thermal stress can be mitigated effectively when P is 1 and n is 6. Compared with the Non-FGM, the maximum working thermal stress of FGM is reduced by 50% when hFGM is 5 mm.
Key words: W/Cu functionally graded material; temperature field; thermal stress
