(北京科技大學 材料科學與工程學院， 北京 100083)
摘 要: 研究了熱-剪切循環(huán)條件下Sn-3.5Ag-0.5Cu釬料/Cu界面的顯微結構， 分析了界面金屬間化合物的生長行為， 并與恒溫時效后的Sn-3.5Ag-0.5Cu/Cu界面進行了對比。 結果表明： 恒溫時效至100 h， Sn-3.5Ag-0.5Cu/Cu界面上已形成Cu6Sn5和Cu3Sn兩層金屬間化合物； 而熱-剪切循環(huán)至720周Sn-3.5Ag-0.5Cu/Cu界面上只存在Cu6Sn5金屬間化合物層， 無Cu3Sn層生成， 在界面近域的釬料內， 顆粒狀的Ag3Sn聚集長大成塊狀； 在熱-剪切循環(huán)和恒溫時效過程中， 界面金屬間化合物的形態(tài)初始都為扇貝狀， 隨著時效時間的延長逐漸趨于平緩， 最終以層狀形式生長。
關鍵字: 熱-剪切循環(huán)； 恒溫時效； Sn-3.5Ag-0.5Cu/Cu界面； 金屬間化合物
（School of Materials Science and Engineering,
University of Science and Technology Beijing, Beijing 100083, China）
Abstract: The microstructure of Sn-3.5Ag-0.5Cu/Cu interface after thermal-shearing cycling was investigated. Compared with Sn-3.5Ag-0.5Cu /Cu interface after isothermal aging, the development of interfacial IMC during thermal-shearing cycling was studied too. The results show that Cu6Sn5 and Cu3Sn IMC layers have formed at the interface of Sn-3.5Ag-0.5Cu/Cu after isothermal aging for 100 h, while only Cu6Sn5 IMC layer, no Cu3Sn layer, presents at the Sn-3.5Ag-0.5Cu/Cu interface after thermal-shearing cycling for 720 cycles, and particle-like phase Ag3Sn grows into massive phase in the field near to the interface. The interfacial IMC exists as scallop-like in the initial aging, during either thermal-shearing cycling or isothermal aging. Then they gradually grow up to planar-like with the aging time increasing.
Key words: thermal-shearing cycling; isothermal aging; Sn-3.5Ag-0.5Cu/Cu interface; intermetallic compound (IMC)
