(1. 湖南大學(xué) 材料科學(xué)與工程學(xué)院，長(zhǎng)沙 410082；
2. 北京科技大學(xué) 材料科學(xué)與工程學(xué)院，北京100083)
摘 要: 對(duì)采用不同粒度配比和熱壓制備的W-Cu梯度功能材料的熱物理性能進(jìn)行研究。結(jié)果表明：梯度材料的整體熱導(dǎo)率較高，達(dá)到226.4 W/(m∙K)，高于過(guò)渡層W/Cu33的熱導(dǎo)率，低于散熱層W/Cu50的熱導(dǎo)率；封接層具有低的線性熱膨脹系數(shù)， /℃，滿足與BeO基板材料封接匹配的要求；低溫?zé)釅簵l件下制備的W-Cu梯度功能材料各梯度層的熱膨脹系數(shù)具有良好的可控性和可設(shè)計(jì)性能，其實(shí)測(cè)值與理論值十分接近，其誤差值低于6%；耐熱沖擊溫度達(dá)到800 ℃以上，熱疲勞性能可達(dá)500 ℃水淬50次以上。
關(guān)鍵字: W-Cu復(fù)合材料；梯度功能材料；熱導(dǎo)率；熱壓
（1. School of Materials Science and Engineering, Hunan University, Changsha 410082, China;
2. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China）
Abstract: The thermo-physical properties of W-Cu functionally gradient materials fabricated by the method of particle size adjustment combining with hot press were investigated. The results show that the W-Cu functionally gradient material has a high thermal conductivity as 226.4 W/(m∙K), which is higher than that of the transitional layer W/Cu33 and lower than that of the radiating layer, W/Cu50. The sealing layer has a low coefficient of thermal expansion (CTE), /℃, which can match well with the substrate BeO. The CTE of each graded layer by this method has good designability. The experimental value is close to the theoretical value, with error lower than 6%. The thermal shock temperature is higher than 800 ℃ and the thermal fatigue property is more than 50 times by quenching at 500 ℃.
Key words: W-Cu composite material; functionally gradient material; thermal conductivity; hot press
